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Probe card assembly

A probe card and component technology, applied in the field of probe card components, can solve problems such as not being completely satisfactory, and achieve the effect of improving performance

Pending Publication Date: 2022-07-08
MEDIATEK INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

While existing probe card assemblies are often adequate for their intended purpose, they are not entirely satisfactory in all respects

Method used

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  • Probe card assembly
  • Probe card assembly
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Embodiment Construction

[0028] In the following detailed description of embodiments of the invention, reference is made to the accompanying drawings, which form a part hereof, and in which there are shown, by way of illustration, specific preferred embodiments in which the invention may be practiced . These embodiments are described in sufficient detail to enable those skilled in the art to practice them, and it is to be understood that other embodiments may be utilized and mechanical, structural and procedural changes. this invention. Therefore, the following detailed description should not be construed as limiting, and the scope of embodiments of the present invention is limited only by the appended claims.

[0029] It will be understood that although the terms "first," "second," "third," "primary," "secondary," etc. may be used herein to describe various elements, components, regions, layers and / or sections , but these elements, components, regions, layers and / or sections should not be limited ...

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Abstract

The invention discloses a probe card assembly. The probe card assembly comprises a circuit board; the substrate is arranged opposite to the circuit board and electrically connected to the circuit board, the circuit board is provided with a first opening facing the substrate, and / or the substrate is provided with a second opening facing the circuit board; and the at least one passive component is arranged between the circuit board and the substrate and is at least partially accommodated in at least one of the first opening and the second opening. The present invention provides a relatively simple approach to modify the probe card assembly and / or improve the performance of the probe card assembly, which can provide design flexibility for the probe card assembly and enhance the performance and reliability of the probe card assembly.

Description

technical field [0001] The present invention relates to the technical field of semiconductors, and in particular, to a probe card assembly. Background technique [0002] Semiconductor devices can be applied in various fields, such as smart TVs, voice assistant devices (VADs), tablet computers, feature phones, smartphones, automotive electronics, 5G broadband, Wi-Fi 6, and so on. The steps of fabricating a semiconductor device typically include sequentially depositing insulating or dielectric layers, conductive layers, and layers of semiconductor material on a semiconductor substrate, and patterning the various layers of material by photolithography and etching techniques to form on individual blocks of the semiconductor substrate Circuit components and components. The circuit components and elements combined with the various pieces of the semiconductor substrate may be collectively referred to as semiconductor dies (or dies). [0003] After the semiconductor die is fabrica...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R1/073
CPCG01R1/07342G01R1/07371G01R1/07357G01R1/07378G01R31/2889
Inventor 谢东宪
Owner MEDIATEK INC