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Laser drilling ash removal process for HDI circuit board production

A laser drilling and circuit board technology, applied in laser welding equipment, manufacturing tools, metal processing equipment and other directions, can solve the problems affecting the normal use of circuit boards, the circuit boards are easily contaminated with dust, and the carbonization residue is difficult to clean, etc. Low difficulty, ensure cleanliness, and ensure the effect of normal use

Pending Publication Date: 2022-07-12
江西福昌发电路科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the deficiencies of the prior art, the object of the present invention is to provide a laser drilling and ash removal process for the production of HDI circuit boards. Blackened carbonization residue is left on the hole wall, and it is difficult to clean up the carbonization residue in the hole wall. The carbonization residue and dust will affect the technical problem of the normal use of the circuit board.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] When using the laser drilling ash removal process of this technical solution, step 1: firstly, a layer of resin-coated copper foil is laminated on the circuit board, and then copper foil windows corresponding to the blind holes are etched on the resin-coated copper foil layer. The copper thickness at the copper foil window of the board is 8μm, and the diameter of the copper foil window is 0.05mm larger than the diameter of the bottom pad of the blind hole; Step 2: Put the circuit board into the washing machine to clean, clean the dust and impurities on the surface of the circuit board, and then clean the circuit board. The cleaned circuit board is air-dried; Step 3: The circuit board is moved to the laminating machine, the line pressure is set to 0.8kg / cm, the temperature is 100°C, and the conveying speed is 1.5m / min, and the lamination operation is completed, so that the dry film is far away from the circuit board. The distance between the edges of the board is 3mm, and...

Embodiment 2

[0046]When using the laser drilling ash removal process of this technical solution, step 1: firstly, a layer of resin-coated copper foil is laminated on the circuit board, and then copper foil windows corresponding to the blind holes are etched on the resin-coated copper foil layer. The copper thickness at the copper foil window of the board is 9μm, and the diameter of the copper foil window is 0.05mm larger than the diameter of the bottom pad of the blind hole; Step 2: Put the circuit board into the washing machine to clean, clean the dust and impurities on the surface of the circuit board, and then clean the circuit board. The cleaned circuit board is air-dried; Step 3: The circuit board is moved to the laminating machine, the line pressure is set to 0.5kg / cm, the temperature is 100°C, and the conveying speed is 1.0m / min, and the lamination operation is completed, so that the dry film is far away from the circuit board. The distance between the edges of the board is 3mm, and ...

Embodiment 3

[0048] When using the laser drilling ash removal process of this technical solution, step 1: firstly, a layer of resin-coated copper foil is laminated on the circuit board, and then copper foil windows corresponding to the blind holes are etched on the resin-coated copper foil layer. The copper thickness at the copper foil window of the board is 9μm, and the diameter of the copper foil window is 0.05mm larger than the diameter of the bottom pad of the blind hole; Step 2: Put the circuit board into the washing machine to clean, clean the dust and impurities on the surface of the circuit board, and then clean the circuit board. The cleaned circuit board is air-dried; Step 3: Move the circuit board to the laminating machine, set the line pressure to 0.8kg / cm, the temperature to 110°C, and the conveying speed to 1.6m / min to complete the lamination operation, so that the dry film is far away from the circuit board. The distance between the edges of the board is 3mm, and then the dry...

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Abstract

The invention discloses a laser drilling ash removal process for HDI circuit board production, and aims to solve the problems that in the prior art, the surface of a circuit board is prone to being contaminated by dust, black carbonized residues are left on hole walls, the carbonized residues in the hole walls are difficult to clean, and the production efficiency is high. And carbonized residues and dust influence the normal use of the circuit board. The laser drilling ash removal process comprises the following steps: step 1, etching a copper foil window; 2, cleaning dust and impurities on the surface of the circuit board; 3, the circuit board is moved to a film pasting machine, and film pasting operation is completed; and 4, burning off the substrate material in the window by using laser to form the blind hole. According to the laser drilling ash removal process, by means of the design that the dry film is attached to the surface of the circuit board, cleanliness of the circuit board is guaranteed, meanwhile, drilling operation is conducted in the mode that CO2 laser and YAG laser are combined, the inner wall of a hole formed through the YAG laser is clean and free of carbonization, cleanliness of the surface of the circuit board and the interior of the hole wall is guaranteed, and normal use of the circuit board is guaranteed.

Description

technical field [0001] The invention belongs to the field of HDI production, in particular to a laser drilling ash removal process for HDI circuit board production. Background technique [0002] The more times the HDI circuit board is laminated, the higher the technical grade of the board. High-density integration technology can make the terminal product design more miniaturized, while meeting higher standards of electronic performance and efficiency. HDI circuit boards are widely used in mobile phones, Digital cameras, notebook computers and other digital products. [0003] At present, the invention patent with the patent number of CN201611049230.2 discloses a drilling method for laser blind holes in a multilayer circuit board, which includes the following steps: micro-etching the surface layer copper to be processed in the multilayer circuit board, and micro-etching the surface copper of the multilayer circuit board. Etch off part of the copper layer and retain the surfac...

Claims

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Application Information

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IPC IPC(8): H05K3/42H05K3/26B23K26/382
CPCH05K3/421H05K3/26B23K26/382H05K2203/107
Inventor 叶何远苏惠武陈小杨曹东
Owner 江西福昌发电路科技有限公司
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