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Integrated patch type piezoelectric ceramic structure and circuit board with ceramic

A piezoelectric ceramic and SMD technology, applied in the field of piezoelectric ceramics, can solve the problem of high cost, achieve the effect of improving quality, improving stability and ensuring reliability

Inactive Publication Date: 2022-07-12
常州市武进天一电子器件有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the paper cone is generally made of cotton, wood pulp, wool or spun silk extracts, the whole is relatively fragile, and an additional net cover is generally required for protection, resulting in higher costs

Method used

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  • Integrated patch type piezoelectric ceramic structure and circuit board with ceramic
  • Integrated patch type piezoelectric ceramic structure and circuit board with ceramic
  • Integrated patch type piezoelectric ceramic structure and circuit board with ceramic

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] The present application discloses an integrated patch type piezoelectric ceramic structure. refer to figure 1 and figure 2 , an integrated patch type piezoelectric ceramic structure includes an integrally formed piezoelectric ceramic body 1, a support portion 2 and a recessed portion 3, all of which are made of piezoelectric ceramics. The support portion 2 is located at the bottom of the piezoelectric ceramic body 1 to facilitate supporting the piezoelectric ceramic body 1 . The recessed part 3 is located at the center of the piezoelectric ceramic, the recessed part 3 is recessed along the direction of the piezoelectric ceramic body 1 towards the support base 2 , and the height of the recessed part 3 is not greater than the height of the support base 2 to ensure the stability of the support base 2 . The outer ring of the support base 2 can be polygonal, circular or oval, and in this application, it is circular.

[0041] refer to image 3 , the diameter of the conc...

Embodiment 2

[0049] The difference from Example 1 is that refer to Image 6 , The circuit board is arc-shaped, and several piezoelectric ceramic structures are installed on the curved inner surface of the circuit board, which is convenient to make the emitted ultrasonic waves more concentrated.

Embodiment 3

[0051] The difference from Example 1 is that refer to Figure 7 , the circuit board is cylindrical, and several piezoelectric ceramic structures are installed on the outer surface of the circuit board, so that the ultrasonic wave can be propagated to a wider range.

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Abstract

The invention relates to an integrated patch type piezoelectric ceramic structure and a circuit board with the same, and relates to the field of piezoelectric ceramics, the integrated patch type piezoelectric ceramic structure comprises a piezoelectric ceramic body, the piezoelectric ceramic body is provided with a concave part, the section of the concave part cut by a plane parallel to the piezoelectric ceramic body is circular, and the piezoelectric ceramic body is provided with a plurality of through holes. The diameter of the concave part is gradually increased in the direction from the concave part to the piezoelectric ceramic body, and the concave part is made of piezoelectric ceramic. The sound pressure of the ultrasonic waves generated by the concave part is high, the frequency is stable, sound production by means of a paper cone is not needed, the cost is saved, vibration is not needed to be transmitted to the paper cone for vibration sound production, the energy loss is reduced, the quality of the ultrasonic waves is improved, and compared with the paper cone, the sound production efficiency is improved. And the sunken part is not easy to influence the ultrasonic quality due to the permeation of water.

Description

technical field [0001] The present application relates to the field of piezoelectric ceramics, and in particular, to an integrated chip piezoelectric ceramic structure and a circuit board with the ceramics. Background technique [0002] Ultrasonic sensors are sensors that convert ultrasonic signals into other energy signals (usually electrical signals). Ultrasound is a mechanical wave whose vibration frequency is higher than 20kHz. It has the characteristics of high frequency, short wavelength, small diffraction phenomenon, especially good directionality, which can become a ray and propagate in a direction. Ultrasound has a great ability to penetrate liquids and solids, especially in solids that are opaque to sunlight. When the ultrasonic wave encounters impurities or interfaces, it will produce significant reflections to form reflected echoes, and when it encounters moving objects, it can produce Doppler effects. Ultrasonic sensors are widely used in industry, national d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/00H05K7/14H05K1/02
CPCH05K5/0091H05K7/1401H05K1/02
Inventor 杨晓波杨阳
Owner 常州市武进天一电子器件有限公司