Chip packaging structure

Abstract

The invention discloses a chip packaging structure, which comprises a plastic package body, a packaging cavity and a packaging structure, and is characterized in that the plastic package body is internally provided with; the base island is arranged in the sealing cavity and located at the midpoint position of the sealing cavity. The at least three pins extend outwards from the side surface of the plastic package body by taking the base island as a central base point and are arranged at intervals along the circumferential direction of the plastic package body, one pin is directly connected with the base island and is used as a grounding pin, and the other pin is used as a grounding pin; the rest of the pins and the base island are arranged at intervals, and a positioning inclined surface is formed at the end part, extending out of the plastic package body, of one of the rest of the pins; the chip is arranged on the base island, and other pins which are not directly connected with the base island are connected with the chip through leads. The distance between the pins is far, the mutual interference is less, the arrangement of the positioning inclined plane is easy to weld and position in a printed circuit board, and one pin is directly connected with the base island, so that the lead cost is saved. The heat dissipation area can be effectively increased, the heat dissipation performance of the packaging structure is improved, and the welding reliability is enhanced.

Description

technical field [0001] The invention belongs to the technical field of chip packaging, and in particular relates to a chip packaging structure. Background technique [0002] Chip packaging refers to the shell used for semiconductor integrated circuit chips, which plays the role of placing, fixing, sealing, protecting the chip and enhancing the electrical and thermal performance, and is also a bridge to communicate the internal world of the chip and the external circuit - the contacts on the chip are connected by wires to the pins of the package housing, which in turn establish connections to other devices through wires on the printed board. Because the chip must be isolated from the outside world, in order to prevent the corrosion of the chip circuit caused by the impurities in the air, the electrical performance will be degraded. On the other hand, the packaged chips are also easier to install and transport. Since the quality of packaging technology directly affects the p...

AI Technical Summary

Problems solved by technology

Because the chip must be isolated from the outside world to prevent impurities in the air from corroding the chip circuit and causing electrical performance degradation

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