Unlock instant, AI-driven research and patent intelligence for your innovation.

IGBT chip junction temperature estimation compensation method and system

A compensation method and chip technology, applied in computing, computer-aided design, design optimization/simulation, etc., can solve problems such as inability to obtain accurate temperature sampling results, attenuation, etc., and achieve the effect of improving transient thermal protection capabilities

Pending Publication Date: 2022-07-22
LEADRIVE TECH (SHANGHAI) CO LTD +1
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the actual driving process, when the IGBT chip receives a high-speed and high-frequency control signal, the actual junction temperature thermal ripple represented by the sampling value of the on-chip temperature sensor connected to it has attenuation compared with the real value. The reason is that , after the temperature sampling point of the IGBT chip is sampled, the on-chip sensor and related sampling circuit will filter the sampling signal. During the filtering process, the accurate temperature sampling result cannot be obtained due to the influence of the filter time constant.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • IGBT chip junction temperature estimation compensation method and system
  • IGBT chip junction temperature estimation compensation method and system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0047] The advantages of the present invention are further described below with reference to the accompanying drawings and specific embodiments.

[0048] Exemplary embodiments will be described in detail herein, examples of which are illustrated in the accompanying drawings. Where the following description refers to the drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the illustrative examples below are not intended to represent all implementations consistent with this disclosure. Rather, they are merely examples of apparatus and methods consistent with some aspects of the present disclosure as recited in the appended claims.

[0049] The terminology used in the present disclosure is for the purpose of describing particular embodiments only and is not intended to limit the present disclosure. As used in this disclosure and the appended claims, the singular forms "a," "the," an...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides an IGBT chip junction temperature estimation compensation method and system, and the method comprises the following steps: selecting a junction temperature reference point of an IGBT chip, and taking the detection temperature of an on-chip sensor as a reference temperature; a test or simulation working condition is set, and junction temperature hot ripples of the junction temperature reference point are obtained; detecting the test detection temperature of the on-chip sensor, and recording the test detection temperature as a sampling thermal ripple; fitting a filter equivalent model and parameters thereof; acquiring the actual detection temperature of the on-chip sensor, and performing FFT frequency decomposition on the actual detection temperature to obtain different frequency components of the sampling thermal ripple of the actual detection temperature; obtaining attenuation values of different frequency components to obtain frequency component compensation amplitudes; iFFT frequency synthesis is carried out on the frequency component compensation amplitude, a real-time junction temperature compensation value is obtained, and the actual detection temperature is corrected. After the technical scheme is adopted, a measurement result of relatively large switching frequency fluctuation caused by relatively low switching frequency under a high-speed working condition and a high fundamental frequency can be compensated, so that the transient thermal protection capability is improved.

Description

technical field [0001] The invention relates to the field of motor control, in particular to a method and a system for estimating and compensating the junction temperature of an IGBT chip. Background technique [0002] With the rapid development of new energy vehicles, electric or hybrid vehicles have entered thousands of households. During use in electric or hybrid vehicles, IGBT chips are connected to the motor windings and are used to switch on or off during switching cycles to control the current generated by the motor windings. [0003] In the actual driving process, when the IGBT chip receives a high-speed and high-frequency control signal, the actual junction temperature thermal ripple represented by the sampled value of the on-chip temperature sensor connected to it is attenuated compared with the real value. The reason is that , After the temperature sampling point of the IGBT chip is sampled, the on-chip sensor and related sampling circuit will filter the sampling...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F30/23G01R31/26G06F119/08
CPCG06F30/23G01R31/2619G01R31/2601G06F2119/08
Inventor 李一粟包慧创海栋
Owner LEADRIVE TECH (SHANGHAI) CO LTD