Power management chip packaging structure and manufacturing method thereof

Abstract

The invention discloses a power management chip packaging structure and a manufacturing method of the packaging structure. The packaging structure comprises a substrate; the at least one power supply chip is arranged on the upper surface of the substrate and is electrically connected with the substrate; the at least one conductive connecting piece is electrically connected with the substrate; the at least one inductor is arranged above the power supply chip and is electrically connected to the substrate through the conductive connecting piece; the plastic package body covers the substrate, the power supply chip and the conductive connecting piece, and exposes the upper surfaces of the inductor, the power supply chip and the conductive connecting piece; and the radiating fin at least partially covers the outer surface of the inductor. Heat generated by working of the chip and the inductor can be transmitted to an outer space through the cooling fins for heat dissipation; the plastic package body exposes the inductor, and the outer surface of the inductor is coated with the cooling fin, so that the heat dissipation of the inductor is facilitated, and the heat dissipation performance of the package structure is further improved.

Description

technical field [0001] The invention relates to the field of semiconductor packaging, in particular to a power management chip packaging structure and a manufacturing method of the packaging structure. Background technique [0002] The power management chip is responsible for the transformation, distribution, detection and other power management of electrical energy in the electronic equipment system. The power management chip is indispensable to the electronic system, and its performance has a direct impact on the performance of the whole machine. [0003] The traditional power management chip adopts the packaging method of chip ECP (Electrochemical Plating, electrochemical plating), and the inductance is pasted on the substrate. In the prior art, the chip packaging structure with inductance is used for a long time. The heat energy generated by the chip operation is relatively large. Due to the characteristics of the packaging plastic body, its heat dissipation performance...

AI Technical Summary

Problems solved by technology

[0003] The traditional power management chip adopts chip ECP (Electrochemical Plating, electrochemical plating) packaging method, and an inductor is pasted on the substrate. In the prior art, the chip package structure with an inductor, in long-term use, the inductor and The heat energy generated by the chip operation is relatively large. Due to the characteristics of the plastic packaging body, its heat dissipation performance is poor, and the heat dissipation speed is low, which can easily cause damage or aging of the chip and greatly reduce the service life of the chip.

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