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Rapid heat dissipation multilayer HDI printed circuit board

A printed circuit board, circuit board technology, applied in the direction of printed circuit components, etc., can solve the problems affecting the normal operation of electronic components, reducing the service life of circuit boards, heat dissipation, etc., to achieve high-efficiency heat dissipation, prolong service life, and ensure normal working effect

Pending Publication Date: 2022-07-26
惠州市凌航达科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on this, it is necessary to provide a rapid heat dissipation multilayer for the technical problem that the traditional HDI printed circuit board cannot effectively discharge heat, which seriously affects the normal operation of each electronic component and reduces the service life of the circuit board. HDI printed circuit board

Method used

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  • Rapid heat dissipation multilayer HDI printed circuit board
  • Rapid heat dissipation multilayer HDI printed circuit board
  • Rapid heat dissipation multilayer HDI printed circuit board

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Embodiment Construction

[0021] In order to make the above objects, features and advantages of the present invention more clearly understood, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed below. In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", " Back, Left, Right, Vertical, Horizontal, Top, Bottom, Inner, Outer, Clockwise, Counterclockwise, ...

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Abstract

The invention provides a multilayer HDI printed circuit board capable of rapidly dissipating heat. Heat generated by working of a circuit board body is transmitted to a heat conducting plate through a heat conducting layer of the circuit board body and finally transmitted to an annular heat conducting pipe. And the pressure pump works to enable the refrigerant to circularly flow among the annular heat conduction pipe, the output heat conduction pipe and the backflow heat conduction pipe. The refrigerant transmits heat of the annular heat conduction pipe to the output heat conduction pipe and the backflow heat conduction pipe. On one hand, the heat conduction plate, the annular heat conduction pipe, the output heat conduction pipe and the backflow heat conduction pipe can effectively dissipate heat, and on the other hand, the cooling fan works to accelerate the heat dissipation process of the output heat conduction pipe, so that the temperature of a refrigerant flowing through the output heat conduction pipe is reduced, and the refrigerant with the reduced temperature flows into the annular heat conduction pipe again. According to the multilayer HDI printed circuit board capable of rapidly dissipating heat, heat dissipation processing can be efficiently carried out on the circuit board body in an air cooling mode and a water cooling mode at the same time, normal work of all electronic elements can be guaranteed, and the service life of the circuit board body is prolonged.

Description

technical field [0001] The invention relates to the field of circuit board processing, in particular to a fast heat dissipation multi-layer HDI printed circuit board. Background technique [0002] A printed circuit board, also known as a printed circuit board, is a provider of electrical connections for electronic components. The printed circuit board is mostly represented by "PCB", and its development has a history of more than 100 years. The design of circuit boards is mainly layout design. The main advantage of using circuit boards is to greatly reduce wiring and assembly errors, and improve the automation level and production labor rate. According to the number of layers of the circuit board, it can be divided into single-sided, double-sided, four-layer, six-layer and other multi-layer circuit boards. Before the advent of printed circuit boards, the interconnections between electronic components depended on the direct connection of wires to form a complete circuit. In...

Claims

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Application Information

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IPC IPC(8): H05K1/02
CPCH05K1/0272H05K1/0203
Inventor 罗建辉蓸云华
Owner 惠州市凌航达科技有限公司
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