Preparation process of laminated structure of outer-layer flexible rigid-flex circuit board

Abstract

The invention discloses a preparation process of an outer-layer flexible rigid-flex circuit board laminated structure. The preparation process comprises the following steps of: pasting a covering film on a flexible circuit layer of which a single surface is etched; carrying out primary brownification on the flexible substrate which is pasted with the covering film and cured; pasting a high-temperature uncovering protective film on the whole surface of the flexible substrate subjected to primary browning; the high-temperature uncovering protective film is cut in a laser depth-controlled cutting mode, and the high-temperature uncovering protective film in a non-flexible area is removed; if the prepreg is not hollowed out, carrying out lamination; removing the rigid substrate in the flexible area by outer layer depth control; and removing the high-temperature uncovering protective film in the flexible area. The prepreg is not hollowed out by optimizing the laminated structure, the high-temperature uncovering protective film is added in the flexible bending area and used for isolating the prepreg from the flexible substrate, separation of the rigid substrate and the flexible substrate is not affected on the basis of the isolation effect, so that flatness of the flexible substrate on the outer layer is achieved, and the yield of the flexible substrate is improved. The problem that a dynamic flexible bending area is difficult to machine is solved.

Description

technical field [0001] The invention relates to the field of circuit board laminated structure preparation, in particular to a preparation process of an outer-layer flexible rigid-flex circuit board laminated structure. The high temperature resistant protective film is added to the natural layer, which is convenient for separation and avoids the depression of the dynamic area, and solves the problem of the outer laminated film. Background technique [0002] With the precision and miniaturization of electronic devices, rigid-flex circuit boards have been applied in more and more fields with the advantages of multi-dimensional installation and arbitrary layer interconnection; The flexible bending area of ​​the prepreg is hollowed out, and then the flexible substrate and the rigid substrate are stacked by pressing and bonding, and finally the rigid layer of the flexible area is removed by laser depth control, thereby exposing the flexible substrate and finally forming a rigid-f...

AI Technical Summary

Problems solved by technology

[0007] According to the problems raised by the background technology, the present invention provides a preparation process for the laminated structure of the outer flexible rigid-flex circuit board to solve the problem. By optimizing the laminated structure, the prepreg is not hollowed out, and the high temperature resistance is increased in the flexible area. The protective film is used to isolate the prepreg and the flexible substrate. Because the prepreg is not hollowed out and formed without depressions, the isolation effect of the high-temperature adhesive barrier film does not affect the separation of the rigid substrate and the flexible substrate, so as to achieve the smoothness of the outer flexible substrate and solve the problem. Solved the difficult problem of difficult processing of the outer layer circuit caused by the depression in the dynamic flexible bending area

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