Conductive adhesive dripping judgment method based on ultrasonic waves

Abstract

The invention provides a conductive adhesive dripping judgment method based on ultrasonic waves. The conductive adhesive dripping judgment method comprises the following steps that coordinate values of a dripper are obtained, whether the coordinate values are consistent with preset coordinate values or not is judged, an ultrasonic wave generating device is started, and an ultrasonic wave signal is sent out towards the direction of a reflecting plate; the ultrasonic signals are received by the ultrasonic generating device after being reflected; the dripper drips conductive adhesive to the substrate; the control module judges whether the echo time of the ultrasonic signal is greater than preset echo time or not; if yes, considering that the conductive adhesive does not drop normally; meanwhile, characteristics such as waveform, amplitude and frequency of the ultrasonic echo signal are detected, and whether the conductive adhesive has defects or not is judged and detected; judging that the conductive adhesive is normal if the conductive adhesive passes and has no defect, otherwise, judging that the conductive adhesive is abnormal; according to the invention, the dripping position of the conductive adhesive, the dripping speed and whether the conductive adhesive has surface defects can be monitored.

Description

technical field [0001] The invention relates to a method for judging the dropping of conductive glue based on ultrasonic waves. Background technique [0002] In the liquid crystal display industry, the liquid crystal display panel is usually powered by the upper and lower substrates at the same time, and the electric field of each pixel unit is controlled by the circuit to achieve the purpose of controlling the liquid crystal deflection, so as to realize the control of the light intensity of a single pixel point. [0003] At present, the upper and lower substrates use conductive adhesive (also known as conductive gold balls) to realize the conduction of the upper and lower substrate circuits, while the conductive adhesive used in the traditional sense is composed of internal polymer microspheres as the core, metal nickel as the intermediate link layer, and gold cladding. Covered on the outer layer of metal nickel, the conductive glue with core-shell structure constructed, so...

AI Technical Summary

Problems solved by technology

At the same time, in the production process of conductive adhesive, due to the immature process control technology in the use of new materials, LCD display defects, such as display dark spots, dark lines, etc. 1. The quality has a great influence on the display panel. Therefore, to ensure the quality of the LCD, it is necessary to judge the dripping conductive glue to improve the yield rate of the LCD.

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