Upper chip for secondary board of optic mouse and optical mouse using same

Abstract

A sub chip on board for an optical mouse is disclosed. The chip on board has a sub PCB having both a plurality of input / output pads and a plurality of pin holes. A sensor die has an optical sensor wire-bonded to said input / output pads for sensing received light, and is attached to a bottom surface of the sub PCB. A transparent resin covers the sensor die at the bottom surface of the sub PCB. A cap is attached to the bottom surface of the sub PCB such that the cap covers the transparent resin, and has a hole for guiding the received light to said optical sensor. A main PCB has both a hole for guiding the received light to the optical sensor and a plurality of pin holes corresponding to the pin holes of the sub PCB. A plurality of pins are commonly inserted into the pin holes of both the main PCB and the sub PCB.

Description

technical field [0001] The present invention generally relates to a secondary chip-on-board (COB) for an optical mouse, and more particularly, to a secondary printed circuit board (hereinafter referred to as PCB) by directly fixing an IC chip to a secondary printed The sub-board chip formed by mounting the PCB on the main PCB. Background technique [0002] Optical mice generally operate by reflecting light emitted by the optical mouse body from an object in contact (eg, a mouse pad), thereby enabling detection of mouse movement on the mouse pad and enabling movement of a cursor on a computer display. An optical mouse is a pointing device (or a display cursor control device) operated by a user's click, and is an input device independent of a keyboard. In particular, the optical mouse has the advantages of being able to accurately detect the movement of the user's hand and smooth movement compared with the traditional ball mouse, making it more and more used. This optical mo...

AI Technical Summary

Problems solved by technology

However, the problem with the construction disclosed in U.S. Patent No. 4,751,505 is that its manufacturer must purchase packaged IC chips from the chip manufacturer and figure 2 and 3 Mount them on the PCB in the same manner as described for the Chip-on-Board

[0008] As mentioned above, a disadvantage of the conventional chip-on-board of an optical mouse is that the chip-on-board manufacturer must purchase from the chip manufacturer a fully packaged sensor IC chip including a lead frame for soldering the IC chip to the PCB, and mount the chip on the PCB. on the PCB

In addition, the conventional chip-on-board has a problem that it needs a housing to protect the packaged IC chip, thus increasing the manufacturing cost and reducing the manufacturing efficiency

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