Manifold incorporating thermoelectric module and cooling device using thermoelectric module

Abstract

A manifold incorporating a thermoelectric module having a wide contact of a heat medium with a heat transfer surface of the thermoelectric module and an excellent heat exchange efficiency, and a circular thermoelectric module easily manufactured and constructed into a multi-stacked structure. The manifold (1) comprises a cooling-side manifold piece (2), a heating-side manifold piece (3), a cooling-side agitating member (5), a heating-side agitating member (6), a thermoelectric module (7) and a motor member (8). Heat transfer surfaces (50, 51) of the thermoelectric module (7) are disposed vertically, so that if air enters the cavities (52, 55), air rises along the heat transfer surfaces (50, 51) and exhausted from the exhaust ports (22, 43) at the top of the manifold (1). The cooling-side agitating member (5) and the heating-side agitating member (6) are provided with permanent magnets (33), so that the cooling-side agitating member (5) receives a driving force from the heating-side agitating member (6) and is rotated. A square thermoelectric module (11) is held between aluminium disks (12,13) to form a circular thermoelectric module (10).

Description

technical field [0001] The present invention relates to manifolds incorporating thermoelectric modules. In addition, the present invention also relates to a cooling device and a thermoelectric module using a thermoelectric module. technical background [0002] In recent years, the destruction of the ozone layer by freon gas has become a global problem, and therefore, the development of cooling devices that do not use freon gas has been rapidly proceeding. Therefore, a cooling device that does not use Freon gas, which has attracted much attention, has been proposed that uses a thermoelectric module. [0003] Here, the so-called thermoelectric module refers to the well-known Peltier (Peltier) module or a component of a thermoelectric module, which has two heat transfer surfaces, and when a current flows through the component, one of the heat transfer surfaces is Heating, while the other heat transfer surface is cooled. [0004] A cooling device using a thermoelectric module...

AI Technical Summary

Problems solved by technology

However, according to the structure disclosed by the prior art, there will be a problem of manufacturing difficulties

That is to say, the structure disclosed in the prior art is to arrange the Peltier element 200 and the electrode 202 in a circular shape, so positioning work and the like are difficult to perform.

[0017] In addition, Peltier elements can achieve lower temperatures by stacking them in multiple layers, but it is difficult to stack Peltier elements in multiple layers according to the conventional structure.

[0018] And, adopt the cooling device of thermoelectric module of prior art, then must be equipped with the pump that is used for circulating heat medium

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