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Fixed fastener of radiator

A technology for fixing buckles and heat sinks, which is applied in the direction of instruments, electric solid devices, semiconductor devices, etc. It can solve problems such as deformation, insufficient rigidity, and damage to the main board 100, so as to reduce manufacturing costs, overcome the problem of board bending, and not easily fall off Effect

Inactive Publication Date: 2005-05-11
WISTRON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It can be seen from the figure that the structure of the fixing buckle 130 is very complex and bulky, and the assembly between the fan 140 and the fixing buckle 130, the rotating pressing piece 131 and the fixing buckle 130 is also very complicated. In addition, Since the fixing buckle 130 is made of plastic, its rigidity is relatively insufficient, and it is easy to deform under the condition of heavy load, which may cause the board bending phenomenon of the main board 100, thereby causing the main board 100 to be damaged.
[0004] From the above description, we can see that the products suggested by Intel are not only very complicated in the manufacturing process, but also may cause board bending after assembly, which is easy to be damaged for the main board, and its price is relatively high. too economical

Method used

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  • Fixed fastener of radiator
  • Fixed fastener of radiator
  • Fixed fastener of radiator

Examples

Experimental program
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Effect test

Embodiment 1

[0022] Please refer to figure 2 , which shows the situation where the heat sink provided by Embodiment 1 of the present invention is arranged on the motherboard. As shown in the figure, the heat sink 200 is fixed on the motherboard 100 by a fixing buckle, and the heat sink 200 is closely attached to the surface of the CPU 106 to improve heat dissipation efficiency. The fixing buckle is composed of a rigid frame 220 and an elastic piece 230 , and a fan is arranged on the heat sink 200 , which is not shown in the figure. Then please refer to Figure 3A , which depicts the figure 2 Top view of the radiator. The heat sink 200 is made of extruded aluminum, and fixed pieces 301, 302 are formed on both sides thereof. Then please refer to Figure 3B , which depicts the Figure 3A Front view of the radiator. As shown in the figure, the fixing pieces 301, 302 are integrally formed with the heat sink 200, protruding from both sides of the heat sink 200, forming a shape as shown ...

Embodiment 2

[0026] Then please refer to Figure 6 , which shows the situation that the heat sink provided according to the second embodiment of the present invention is arranged on the motherboard. As shown in the figure, the heat sink 600 is fixed on the motherboard 100 by a fixing buckle, and the heat sink 600 is closely attached to the surface of the CPU 106 to improve heat dissipation efficiency. The fixing buckle is composed of a rigid frame 620 and an elastic piece 230 , and a fan is disposed on the heat sink 600 , which is not shown in the figure for convenience of description. Next please refer to Figure 7A , which depicts the Figure 6 Top view of the radiator. The heat sink 600 is also made of extruded aluminum, but the fixing piece 701 is located at the center of the heat sink 600 . Then please refer to Figure 7B , which depicts the Figure 7A Front view of the radiator. As shown in the figure, the fixing piece 701 is integrally formed with the heat sink 600 to form a ...

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Abstract

A fixing buckle for a heat sink is used to closely attach the heat sink to the surface of a central processing unit. The fixing buckle includes: a rigid frame configured at the slot of the central processing unit and fixed on the The front of the motherboard is used to carry the radiator and provide the rigidity of the motherboard to avoid deformation. The rigid frame is equipped with screw holes; and the shrapnel is used to fix the radiator on the surface of the central processing unit, and on the rigid frame , and provide the downward force of the radiator through the elastic force, and the shrapnel is equipped with shrapnel through holes. Wherein, the hand lock screw can be penetrated through the through hole and the screw hole of the elastic piece to lock the elastic piece on the rigid frame, and press and fix the heat sink on the surface of the central processing unit.

Description

technical field [0001] The invention relates to a fixing buckle for a heat sink, in particular to a fixing buckle which can reduce the bending phenomenon of a mainboard and reduce costs. Background technique [0002] With the development of electronic industry technology, the transistor density of the central processing unit (Central Processing Unit, referred to as CPU) is increasing day by day. Although the speed of data processing is getting faster and faster, the power consumption and heat generation are also increasing. In order for the central processing unit to operate stably, a high-efficiency radiator has become an inevitable requirement. In order to maintain a high-efficiency heat dissipation function, the volume and weight of the heat sink have to be larger and heavier accordingly. On the contrary, how to fix a large and heavy heat sink on the CPU so that it is not easy to be damaged due to Vibration and dropping will be a problem to be ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20H01L23/34H05K7/20
Inventor 余宗兮吴义彬
Owner WISTRON CORP