Oxidation-inhibited lead-free welding materials

Abstract

A lead-free solder with oxidation resistance relates to a solder composition, especially a lead-free solder composition. It is composed of the following chemical components in weight percentage: Ag 0.5-5%, Cu 0-2%, P0.001-1%, RE 0.01-1%, Sn balance. The solder of the invention does not contain Pb, and compared with the existing Sn-Ag-Cu solder alloy, it shows superior characteristics in terms of solidification structure, mechanical properties and creep fatigue resistance of the solder. It solves the problem of low oxidation resistance existing in the existing lead-free solder.

Description

Technical field: [0001] The invention relates to a solder composition, especially a lead-free solder composition. Background technique: [0002] Currently, typical solders used in electronic packaging and assembly in the electronics industry are Sn-Pb alloys. Although Sn-Pb alloys have excellent wettability, weldability, electrical conductivity, mechanical properties, and low cost, Pb and Pb-containing substances are toxic and harmful substances that endanger human health and pollute the environment. With the improvement of environmental protection laws and regulations, the call for prohibiting the use of lead is increasing. Japan, the European Union and the United States have successively formulated their own lead-free solder standards. Among them, Japanese companies have begun to use lead-free solder in their products. In the last year's COST lead-free solder alloy research plan, the body proposed to require all lead-free solders to be used by 2008. Therefore, there is a...

AI Technical Summary

Problems solved by technology

[0003] The invention provides a lead-free solder with oxidation resistance, which sol