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Equipment for in-line exchange of substrate in vacuum chamber

A vacuum chamber and substrate technology, applied in vacuum evaporation plating, metal material coating process, coating, etc., can solve the problem that the uniformity of the film cannot be guaranteed, and achieve the effect of shortening the development cycle and easy operation

Inactive Publication Date: 2005-08-24
SHANGHAI INST OF OPTICS & FINE MECHANICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, the device for changing the coating substrate (commonly referred to as the control plate) on-line in the coating machine has been successfully applied to various types of coating machines, but the reference plate is static during the coating process and does not follow The workpiece rotates, so that the uniformity of the film cannot be guaranteed, especially on a small coating machine with a relatively small uniform area
For the online dynamic change of the substrate rotating around a certain axis during the coating process, the prior technology is powerless

Method used

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  • Equipment for in-line exchange of substrate in vacuum chamber
  • Equipment for in-line exchange of substrate in vacuum chamber
  • Equipment for in-line exchange of substrate in vacuum chamber

Examples

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Embodiment 1

[0018] Example 1: Different deposition parameters are realized by using a dynamic film changing mechanism for comparative work.

[0019] The above-mentioned first structure is adopted in the rotating fixture part of the ion beam sputtering coating machine, such as figure 1 shown.

[0020] image 3 It is a schematic diagram of the plane of the circular substrate holder 3 used, and six holes 301 are evenly distributed on the substrate holder 3 to place the substrate to be coated. Figure 4 It is a schematic plan view of the used baffle plate 2 , its apex angle is 300°, and the notch 201 is fan-shaped with an angle of 60°. The baffle plate 2 has the same radius as the substrate holder 3 . Before coating, adjust the relative position of the substrate fixture 3 and the baffle 2, so that the baffle 2 just covers five substrates, and the remaining one is at the 60° fan-shaped gap 201 of the baffle, and is fixed with two top wires 5 and 9 The relative position of the hollow rotati...

Embodiment 2

[0021] Embodiment 2: The accumulation function of deposition time is realized by using a dynamic film changing mechanism.

[0022] In order to study the effect of deposition time on film properties, such as the relationship between film properties and time-dependent changes during film growth, it is necessary to prepare samples with different deposition times under the same deposition parameters. Using devices such as figure 1 The first structure shown. In order to improve efficiency, the shape of the baffle plate 2 adopted in this embodiment is a fan shape with an apex angle of 180°. Its gap 201 is also a sector of 180°. The film preparation time is one, two, four, five, seven and eight hours respectively. Initially, the relative positions of the substrate holder 3 and the baffle 2 are adjusted so that the baffle 2 just covers three substrates to be coated, and the other three substrates are exposed outside the baffle 2 . The positions of substrate holder 3 and baffle pla...

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Abstract

An apparatus for in-line exchange of substrate to be plated in vacuum chamber has a rotation axle composed of concentrical hollow axle and solid axle. When they are fixed together by two screws, the fixture of substrate and the baffle are simultaneously driven to rotate. When they are separated from each other, the fixture of substrate and the baffle are respectively driven by the hollow axle and solid axle to change their relative position, so abling to exchange the substrate. Its advantages are simple structure and easy operation.

Description

Technical field: [0001] The invention relates to a device for on-line replacement of substrates in a vacuum chamber, in particular to a device for dynamically replacing coating substrates in a vacuum chamber of a vacuum coating machine. Background technique: [0002] Thin film materials have been widely used in modern science and technology. A large number of workers have devoted themselves to the research and development of thin films, but to develop a thin film with specific properties, whether it is an optical thin film or a functional thin film, a lot of exploratory work must be done. Vacuum coating technology is currently one of the main ways to prepare thin films with various properties, such as physical vapor deposition (PVD). The preparation of thin films by PVD generally goes through a series of processes such as vacuuming, heating, thin film plating, and cooling. Due to the long time of vacuuming and heating in this process, it often takes a lot of time to explor...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/50
Inventor 齐红基汤兆胜易葵邵建达袁景梅范正修
Owner SHANGHAI INST OF OPTICS & FINE MECHANICS CHINESE ACAD OF SCI
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