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Semiconductor laser device and optical pick-up using it

A laser device and semiconductor technology, which is applied to semiconductor lasers, structural details of semiconductor lasers, semiconductor devices, etc., can solve the problems of expensive hologram components, increased housing, and increased cost, and achieve the effect of easy optical axis adjustment.

Inactive Publication Date: 2006-03-29
SHARP KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

On the other hand, there is no component mounted on the left side of the reflector 86, leaving space
[0021] If the area of ​​the case (support member) is large, the metal material and resin material required for this part also increase, and the cost also increases
In particular, the hologram element is expensive, and it is desired to be as small as possible in order to suppress the cost. However, the enlarged part of the casing and the peripheral part that is not needed are redundant parts that are unnecessary and cause the cost to increase.

Method used

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  • Semiconductor laser device and optical pick-up using it
  • Semiconductor laser device and optical pick-up using it
  • Semiconductor laser device and optical pick-up using it

Examples

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Embodiment 1

[0041] Fig. 1 is an embodiment of the present invention, and is a diagram showing a schematic structure of a semiconductor laser device using a stem as a supporting member, and Fig. 1(a) is a plan view and a front view thereof. In addition, for comparison, a plan view and a front view of a conventional equivalent product are shown together in FIG. 1( b ). In Fig. 1, for the sake of brevity, the description is made with the top cover and the hologram element removed, and the state with these parts removed is the same as Figure 7 same.

[0042] In Fig. 1, 1 is a support as a supporting part, 2 is a semiconductor laser element, 3 is a light receiving element for signal detection, 4 is a lead wire for external connection, and 5 is a connecting element 2, 3 and lead wire 4. wire. The stand 1 functions as a plate-shaped supporting member, and has a planar region surrounded by a pair of left and right opposing end portions and a pair of front and rear opposing side portions. The s...

Embodiment 2

[0049] figure 2 is a diagram showing the structure of a semiconductor laser device according to another embodiment of the present invention. figure 2 In order to further promote miniaturization, the position of the vertical optical path is shifted as far as possible to the left, and the relationship between the curvature radii of the right curved surface 1a and the left curved surface 1b is Ra>>Rb.

[0050] In this example, more lead wires 4 are arranged to the right than the vertical optical path of the laser beam emitted from the semiconductor laser element 2, and the pitch between the lead wires 4 is narrower than that of the first embodiment. As a result, the component mounting area on the left side is further reduced.

Embodiment 3

[0052] image 3 is a configuration diagram showing a semiconductor laser device according to still another embodiment of the present invention. In this example, the semiconductor laser element 2 is mounted so that the laser beam is emitted in the horizontal direction with respect to the upper surface 1c. Furthermore, the laser beam is reflected upward by the reflection mirror 6 (reflector) installed at an angle of 45 degrees with respect to the upper surface 1c, and taken out vertically with respect to the upper surface 1c. That is, the laser beam reflected by the mirror 6 becomes a vertical optical path.

[0053] In addition, as in the case of Example 2, the relationship of the curvature radii of the right curved surface 1a and the left curved surface 1b is Ra>>Rb. And, taking the XX' section parallel to the front side 1e and the rear side 1f passing through the vertical optical path as the center, the width (Ld) of the front side is enlarged wider than the XX' section in t...

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Abstract

A semiconductor laser device, with which a compact and thin optical pickup can be realized, is provided. On the top surface of a supporting member, there is formed an element mounting area for mounting a series of elements including a semiconductor laser element, and a light detecting element which detects a laser beam emitted from the semiconductor laser element and reflected by a surface of an outside optical disc so as to be re-entered. An optical path from the semiconductor laser element to the surface of the optical disc includes a vertical optical path advancing from the element mounting area of the supporting member in an approximately vertical upward direction. On a pair of right and left opposing ends of the supporting member, arcuate curved outer surfaces are formed, respectively, so as to fit the supporting member into an installation hole, for a semiconductor laser device, having arcuate curved inner surfaces. These curved outer surfaces are formed of arcs having the vertical optical path as the central axes, and are so formed that the curvature radiuses of the right and left arcs are different.

Description

technical field [0001] The present invention relates to a semiconductor laser device used in an optical pickup or the like for optically reading information recorded on an optical recording medium such as an optical disc, and an optical pickup using the same. Background technique [0002] Semiconductor laser devices are used in optical pickups for reading optical disc signals such as CD-ROM and MD (mini disc). Among such semiconductor laser devices, there are (1) a type in which a single semiconductor laser device, an optical component, and a signal detection element are dispersed and assembled mainly in the CAN type, and (2) a type in which a diffraction grating, a signal detection element, and a semiconductor laser device are assembled together. The type in which laser elements are integrated is called a hologram laser (hologram laser) method. [0003] Among them, the hologram laser type semiconductor laser device of (2) has a structure in which a semiconductor laser elem...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G11B7/12G11B7/125G11B7/123H01S5/02H01S5/022
CPCH01L2224/49171H01S5/02208H01S5/02248G11B7/1205H01L2224/48091H01S5/02276G11B7/123H01S5/02325H01S5/02345H01L2924/00014
Inventor 小泉秀史八木有百实松原和德金子延容
Owner SHARP KK