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Functional device, mfg. method thereof and drive circuit

一种驱动器电路、功能器件的技术,应用在电路、制造工具、电固体器件等方向,能够解决设备大、复杂组装过程、体积大等问题,达到抑制增大、抑制扩大的效果

Inactive Publication Date: 2006-06-21
DENSO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This will inevitably lead to a complicated assembly process, or lower reliability of the assembled equipment
Because each MEMS module itself adopts a sealed structure, its volume is larger than that of MEMS chips, which makes the devices in large-scale array designs relatively large.

Method used

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  • Functional device, mfg. method thereof and drive circuit
  • Functional device, mfg. method thereof and drive circuit
  • Functional device, mfg. method thereof and drive circuit

Examples

Experimental program
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Embodiment Construction

[0054] specific implementation plan

[0055] Preferred embodiments of the present invention will be specifically described below with reference to the accompanying drawings. It should be noted that the "functional element" described in the summary of the invention corresponds to the "mirror substrate", "filter substrate" or "switch substrate" in the following embodiments; the "functional element" described in the summary of the invention The "processing element" corresponds to the "mirror element", the "variable wavelength filter element part" or the "switching element part" in the following embodiments; and the "connection terminal" described in the Summary of the Invention corresponds to the following "Connection elements" and "connection bumps" in the embodiments.

[0056] First, a first embodiment of the present invention is discussed. figure 1 is a perspective view showing the structure of a functional device according to an embodiment, figure 2 is a cross-sectional v...

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PUM

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Abstract

A functional device and a manufacturing method thereof. A driver circuit substrate is prepared, and the mirror substrate is disposed on the driver circuit substrate. Nine mirror elements are arranged in a 3x3 matrix on the mirror substrate. The mirror elements are fabricated by microelectromechanical systems (MEMS). An insulating substrate is provided on the driver circuit substrate, and a driver circuit for driving the optical mirror element is provided on the insulating substrate. The driver circuit substrate is attached to the mirror substrate by a thermosetting adhesive or the like.

Description

technical field [0001] The present invention relates to a functional device having a functional element that performs processing functions such as input signal conversion, path change, wavelength, and enable / disable electrical connection, etc.; a method of manufacturing such a functional device; and a driver Circuitry, and more particularly to a functional device that controls the operation of the functional device through microelectromechanical parts. Background technique [0002] In an optically connected network system, such as a wavelength division multiplexing (WDM) type optical fiber system, techniques for switching optical paths, and techniques for selecting light of a predetermined wavelength from input light are increasing. This optically connected network system, on each node of the network, uses an optical switch to selectively decompose the predetermined wavelength of light from multi-wavelength light, and then changes the path of light. The amount of communicat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B6/35G02B26/08G02B26/10B81C1/00B81C3/00G02B6/12G02B6/34
CPCB81B2201/047B81C1/00238B81C3/001B81C2201/019G02B6/12007G02B6/29358G02B6/29361G02B6/29362G02B6/29395G02B6/3518G02B6/352G02B6/3546G02B6/3556G02B6/356G02B6/357G02B6/3584G02B6/3588G02B6/3594G02B26/001G02B26/0833G02B26/0841G02B2006/12104H01L2924/0002H01L2924/00
Inventor 奥村俊之
Owner DENSO CORP
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