Circuit structure for connecting weld-pad and electrostatic protective circuit

Abstract

A circuit structure for connecting a pad and an electrostatic discharge protection circuit. The circuit structure includes: multi-layer conductor layers arranged in parallel between the pad and the base at different heights. The multi-layer first via is electrically connected to the conductor layer of the pad and the adjacent pad, and is electrically connected to each adjacent conductor layer. The first wire is electrically connected to the conductor layer closest to the substrate, and is electrically connected to the drain of the electrostatic discharge protection circuit. A plurality of second wires are arranged in parallel between the first wire and the welding pad at different heights, and each second wire is electrically connected to a conductor layer with a different height. The multi-layer second via window electrically connects the first wire and the second wire adjacent to the first wire, and electrically connects each adjacent second wire.

Description

technical field [0001] The present invention relates to a circuit structure connecting a pad and an electrostatic discharge protection (ESD protection, ESD protection) circuit, and in particular to a circuit that connects a pad and an electrostatic discharge protection circuit to form a multilayer Path (multiple paths) structure, and shunting through multi-layer paths to increase the ESD protection capability of components. Background technique [0002] Electrostatic discharge is the phenomenon of movement of static electricity from non-conductive surfaces that can cause damage to semiconductors and other circuit components in an IC. For example, a human body walking on a carpet can detect a static voltage of several hundred to several thousand volts in the case of high relative humidity (RH), and a static voltage of about several hundred to several thousand volts in the case of low relative humidity. With a static voltage of more than 10,000 volts. A machine for packaging...

AI Technical Summary

Problems solved by technology

However, if the thickness W of the extension wire 112a is limited, the extension wire 112a can only solve the problem by widening the wire.

In today's technology where semiconductor components are becoming smaller and more highly integrated, the increase in line width means the reduction of the process margin (window), which is not conducive to the integration of components.

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