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A circuit board and manufacturing method thereof

A manufacturing method and circuit board technology, applied in the direction of printed circuit manufacturing, circuit substrate materials, printed circuits, etc., can solve the problems of insufficient adhesion between the circuit layer and the substrate, affecting the bonding effect between the substrate and the circuit layer, and the volatilization or dissipation of the adhesive.

Inactive Publication Date: 2006-12-27
MINGWEI INVESTMENT
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the general adhesives are mostly made of organic substances. During the hardening reaction process such as hot pressing, the adhesives are easy to volatilize or dissipate, and even release organic vapors and adhere to the surface of the material, thus affecting the bonding effect between the substrate and the circuit layer.
Therefore, it is necessary to reduce the use of adhesive in the circuit board. However, once the amount of adhesive is reduced, it is easy to cause the problem of insufficient indirect force between the circuit layer and the substrate.

Method used

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  • A circuit board and manufacturing method thereof
  • A circuit board and manufacturing method thereof
  • A circuit board and manufacturing method thereof

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Embodiment Construction

[0017] The circuit board disclosed by the present invention and its manufacturing method are to increase the cooling speed of the circuit board through the material of the substrate, and to reduce the volatilization of the adhesive through the structure and material design, and to improve the interface properties between the circuit layer and the substrate.

[0018] Please refer to figure 1 , which is a schematic cross-sectional structure diagram of a circuit board according to an embodiment of the present invention. It is mainly composed of an aluminum metal substrate 10 , a first insulating layer 11 , an adhesive layer 20 , a second insulating layer 12 , an adhesion-promoting layer 30 and a copper circuit layer 40 . The first insulating layer 11 is an aluminum oxide layer formed by anodizing the surface layer of the aluminum metal substrate 10 , and the adhesive layer 20 is coated on the surface of the first insulating layer 11 . A second insulating layer 12 , an adhesion-p...

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Abstract

This invention discloses an electric board and method for making the same, which contains using metal base material as the base material of circuit board, forming the first insulation layer on metal base material surface which covered a follow layer with insulation particle, the second insulation layer covered on the follow layer, adhesion increased layer and circuit layer, wherein the circuit layer used as assembly surface adhesion and electric conduction, the particle contained follow layer can effectively raise the joint strength of insulation and circuit layer and reduce the volatilization of following agent.

Description

technical field [0001] The invention relates to a circuit board and a manufacturing method thereof, in particular to a circuit board capable of reducing adhesive volatilization and a manufacturing method thereof. Background technique [0002] With the gradual development of electronic products in the direction of high performance, high frequency, high speed and light weight, the calorific value per unit volume in components is continuously increasing, and the heat dissipation of components has become the key to the continued development of the electronics industry . In order to remove the heat generated by the electronic components, it is necessary to pass the heat transfer path so that the heat of the electronic components can be transferred to the outside air. Among them, the area and heat dissipation capacity of the metal circuit of the circuit board are limited, and it is still necessary to rely on the composite substrate, such as glass fiber cloth or soft substrate, wh...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/05H05K3/00H05K3/38
Inventor 刘明雄杨明祥朱源发范国华
Owner MINGWEI INVESTMENT