Chip packaging base plate having flexible circuit board and method for manufacturing the same
A flexible circuit board and chip packaging technology, which is applied in the direction of circuit, semiconductor/solid-state device manufacturing, electrical components, etc., can solve the problems of increasing the unqualified rate, consuming manpower, and reducing the holding force, so as to simplify the electrical connection process and reduce Manual operation, the effect of increasing the qualified rate
Inactive Publication Date: 2007-02-28
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Problems solved by technology
[0007] 2. In the method of packaging the image sensor chip with a printed circuit substrate, the bonding of the comb-shaped electrical connection sheet and the printed circuit substrate uses conductive glue as the colloid and conductor, and the two interconnected areas are only comb-shaped. The electrical connection sheet and the small area of the electrical connection sheet of the printed circuit board are adhered, so the bonding strength is small, so that the holding force is reduced
[0008] 3. When the printed circuit board is bonded to the comb-shaped electrical connection piece, the end face of the printed circuit board with the electrical connection piece is likely to be unable to be completely hot-pressed on the printed circuit board due to micro-concaves and convexes. On the other hand, it leads to the inability to firmly adhere to each other, and it is necessary to use a magnifying glass to observe and align the bonding parts of the two components before the adhesion, so the manufacturing time is increased, and it is labor-intensive, and it is difficult to improve the pass rate. In addition, the conductive adhesive Conductivity decreases after a period of time at room temperature, thus increasing the failure rate
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[0043] As shown in Figure 3, the present invention is a chip packaging substrate with a flexible circuit board and its manufacturing method, to package the image sensor chip on the chip packaging substrate, and use the flexible circuit board as an external signal connection line to It is connected to the electronic substrate to form an image sensing module. And the manufacturing method of the chip packaging substrate with the flexible circuit board provides the manufacturing of the chip packaging substrate with the flexible circuit board before the chip packaging, so as to simplify the bonding process of the flexible circuit board after the chip is packaged on the chip packaging substrate.
[0044]As shown in FIGS. 3 and 4, the chip packaging substrate 10 with a flexible circuit board is used to package the image sensing chip 20 on the chip packaging substrate, and the flexible circuit board is used as an external signal connection line, which includes a multi- A multi-layer s...
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The invention is a chip packing substrate with flexible circuit board, used for packing video sensing chip on the substrate, where the flexible circuit board acts as an external signal connection line, including: a multilayer soft-hard compound printed circuit substrate, which contains a hard printed circuit substrate layer and at least a flexible circuit board of extending out of the multilayer hard printed circuit substrate; many guide holes, formed on the multilayer hard printed circuit board and the flexible circuit board; and many electroconductive pieces, plated on the inner edges of the guide holes to connect with the multilayer hard printed circuit board and the flexible circuit board. It can reduce making procedures and increase the yield.
Description
technical field [0001] The invention relates to a chip packaging substrate with a flexible circuit board and a manufacturing method thereof, in particular to simultaneously forming a chip packaging substrate and a flexible circuit board on a soft-hard composite printed circuit board as a chip packaging substrate and external signal connection lines. Background technique [0002] Generally, chips must be packaged and electrically connected to printed boards before they can be installed on electronic devices to be operated and used. Especially, image sensor chips need to be protected by packages so that they can be used correctly and safely. , and it can be operated by being electrically connected to the printed board. [0003] Please refer to Fig. 1A to Fig. 1G, wherein the method for electrically connecting the image sensing chip such as CCD or CMOS to the printed board is to prepare a ceramic packaging base 10a, and a concave is formed on the upper side of the ceramic packa...
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IPC IPC(8): H01L23/12H01L23/48H01L23/50H01L21/48H01L27/146
CPCH01L2224/05554H01L2224/48091H01L2224/49171H01L2924/00014
Inventor 陈惠贞刘明郎陈怡菁
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