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Micro electro-mechanical system method

A micro-electromechanical system, capacitor technology, used in circuits, relays, capacitors, etc.

Inactive Publication Date: 2007-07-11
MOTOROLA SOLUTIONS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Unfortunately, no acceptable proposals have been made so far for the implementation of such mechanisms in organic printed wiring board and high-density interconnect substrate technologies while operating at the mesoscale level.

Method used

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  • Micro electro-mechanical system method
  • Micro electro-mechanical system method
  • Micro electro-mechanical system method

Examples

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Embodiment Construction

[0015] Generally speaking, a post of non-conductive material is formed on a printed circuit board, and a beam formed at least in part of polymer material is fixed to the post (either near one end of the beam or at one end remote from the beam). ), so that the beam is suspended from the printed circuit board. One or more conductor surfaces facing each other can be formed on the beam and printed wiring board to form capacitor plates, switch closure tabs, and other useful mechanisms.

[0016] In one embodiment, the beam is at least some polymer material over its entire length. In another embodiment, at least a portion of the length of the beam is composed of a non-polymeric material such as a conductor. These components can be formed using common printed wiring board technologies, including high-density interconnect technologies, enabling mesoscale MEMS at low cost. Devices such as RF switches and tunable capacitors can be constructed easily and economically, including high fre...

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PUM

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Abstract

A meso-scale MEMS device having a cantilevered beam is formed using standard printed wiring board and high density interconnect technologies and practices. The beam includes at least some polymer material to constitute its length, and in some embodiments also comprises a conductive material as a load-bearing component thereof. In varying embodiments, the beam is attached at a location proximal to an end thereof, or distal to an end thereof.

Description

technical field [0001] Generally, the present invention relates to microelectromechanical systems (MEMS) methods and devices. Background technique [0002] MEMS devices and devices are well known in the art. A great deal of work (few results of commercial breakthroughs) has been directed at small (only a few micrometers) systems, often using semiconductor materials and processing techniques. It has also recently been proposed that printed wiring boards and corresponding fabrication techniques can be used to realize meso-scale MEMS structures (on the order of eg 25-100 microns). For example, U.S. Patent Application Serial No. 09 / 929,750, filed August 14, 2001, by the same assignee of this application, describes a microelectromechanical system that can be Manufactured. [0003] A particularly useful structure to consider in this field involves a cantilever beam. Such structures can be used to implement a variety of useful devices including, for example, radio frequency swi...

Claims

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Application Information

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IPC IPC(8): H01L21/00H01G7/00H01H1/20H01H11/04B81C1/00B81B3/00H01H59/00
CPCH01H2001/0073H01H2059/0054H01G5/16H01H59/0009
Inventor 马奈斯·埃利亚西恩凯恩·莲刘俊华罗伯特·B·伦普考斯基
Owner MOTOROLA SOLUTIONS INC