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Substrate delivery device and method, and vacuum processing device

A technology for vacuum processing devices and substrate transportation, which is applied in the direction of conveyor objects, transportation and packaging, lighting and heating equipment, etc., which can solve the problems of reduced productivity, increased vacuum exhaust time, etc., to achieve increased productivity and reduced Effect of setting up space and preventing volume increase

Inactive Publication Date: 2007-07-11
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as the length of the lift stroke increases, the height of the load lock chamber where the buffer plate is installed becomes higher, and the volume of the load lock chamber increases more than necessary, and the time required for vacuum exhaust increases, reducing productivity.
In addition, the installation space of the conveying mechanism itself in the height direction is also increased more than necessary, which is also a problem.

Method used

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  • Substrate delivery device and method, and vacuum processing device
  • Substrate delivery device and method, and vacuum processing device
  • Substrate delivery device and method, and vacuum processing device

Examples

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no. 1 example

[0043] 1 and FIG. 2 are longitudinal sectional views of a vacuum preparation chamber of a vacuum processing apparatus having a substrate conveying apparatus according to a first embodiment of the present invention; FIG. 3 shows vacuum processing of a substrate conveying apparatus having a first embodiment of the present invention Horizontal sectional view of the device; FIG. 4 is a perspective view showing an example of the structure of the substrate conveying mechanism of the substrate conveying device according to the first embodiment of the present invention; FIG. A perspective view of the appearance of the vacuum processing device.

[0044] The vacuum processing apparatus 100 of the present embodiment has: in a vacuum environment, a vacuum processing chamber 10 for performing desired vacuum processing such as plasma etching processing and thin film forming processing on substrates G such as LCD glass substrates; connected to the vacuum processing chamber 10, The load lock ...

no. 2 example

[0074] Next, a second embodiment of the present invention will be described.

[0075] 7 and 8 are longitudinal sectional views of a vacuum preparation chamber of a vacuum processing apparatus having a substrate conveying apparatus according to a second embodiment of the present invention; FIG. 9 shows a substrate conveying mechanism of the substrate conveying apparatus according to a second embodiment of the present invention and a horizontal cross-sectional view of the arrangement relationship between the first buffer plate and the second buffer plate. In these figures, the same components as those of the first embodiment are denoted by the same symbols, and description thereof will be omitted. In addition, except for the vacuum preparation chamber, the structure is the same as that of the first embodiment.

[0076] In this embodiment, inside the load lock chamber 20, there is a direct-acting substrate transfer mechanism 70' similar to the substrate transfer mechanism 70 of ...

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Abstract

To transfer a relatively large substrate via a vacuum preliminary chamber without increasing the volume of the vacuum preliminary chamber. There are provided within a load-lock chamber (20) connected to a vacuum processing chamber, a substrate transfer mechanism (70) having a structure for carrying out multi-stage slide type transfer operation fot a base plate (71) and a plurality of slide plates (72-74) which are laminated, and a substrate delivery mechanism (80) provided with buffer plates (81, 82) for supporting the peripheral part of the substrate G and a support pin (85) for supporting the central part of the substrate G. Delivery operation for the substrate G between a transfer arm (51) of an atmosphere side transfer mechanism (50) and the substrate transfer mechanism (70) is performed without deflecting the substrate G.

Description

technical field [0001] The present invention relates to substrate transport technology and vacuum processing technology, and in particular to a substrate transport process for glass substrates used in flat-panel displays such as liquid crystal displays (LCDs) and plasma displays, and vacuum processes for performing vacuum processes such as dry etching on the glass substrates. Efficient techniques used in processing units. Background technique [0002] For example, in LCD manufacturing processes, vacuum processing such as dry etching, sputtering, and CVD (Chemical Vapor Growth) is often used on an LCD glass substrate as a substrate to be processed. [0003] In a vacuum processing apparatus that performs such vacuum processing, a vacuum preparation chamber is provided adjacent to a vacuum processing chamber that maintains a vacuum and performs the above-mentioned processing. When loading and unloading substrates to be processed, the change in the environment in the vacuum pro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/68B25J9/06B65G49/07B65G49/06G02F1/13H01L21/3065H01L21/677
CPCB65G60/00G02F1/1303H01L21/67742H01L21/68
Inventor 中山秀树
Owner TOKYO ELECTRON LTD