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Resin packaging semiconductor device

A technology of resin encapsulation and semiconductor, which is applied in the direction of semiconductor devices, semiconductor/solid device manufacturing, semiconductor/solid device components, etc., can solve the problems of high mold manufacturing cost, complex mold shape, and narrow spacing limitation of processing parts, etc., to ensure that effect of tightness

Inactive Publication Date: 2007-08-08
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the shape of the mold becomes complicated, and when the mold is made by a relatively cheap processing method such as cutting, the narrow pitch of the processed parts that can be realized is limited.
In addition, if the pitch of the octopus pot-shaped recesses is narrowed, expensive processing methods such as electrical discharge machining will be used, which will cause a problem of high mold manufacturing costs.

Method used

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  • Resin packaging semiconductor device
  • Resin packaging semiconductor device
  • Resin packaging semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] FIG. 1 shows a resin-encapsulated semiconductor device S in Embodiment 1 of the present invention. A semiconductor element 2 is fixed on a metal plate 6 by solder 4 . The surface electrodes of the semiconductor element 2 and the electrodes of the frame 8 are connected and wired by aluminum wires, a part of the metal plate 6 is fixed to the frame 8 by ultrasonic bonding described later, and then integrally encapsulated with a molding resin 12 .

[0016] The shape of the semiconductor element 2 can be, for example, a square with a side length of 15 mm, and the metal plate 6 can be, for example, a copper plate with a thickness of about 3 mm. In addition, the solder 4 can be selected from a material whose main component is Sn, for example.

[0017] FIG. 2 shows a plan view of the metal plate 6 before welding. As shown in FIG. 2 , on the surface of the metal plate 6 other than the semiconductor element carrying part, a metal plate with a side length of 200 μm is formed verti...

Embodiment 2

[0038] Fig. 4 is a partial view of a metal plate 6A provided on a resin-encapsulated semiconductor device according to Embodiment 2 of the present invention, in which a plurality of octagonal recesses 14A are formed vertically and horizontally at specific intervals on the surface of the metal plate 6A except the portion outside the carrying area . Each octagonal concave portion 14A has the same shape as the square concave portion 14 provided on the resin-molded semiconductor device S of Embodiment 1 (viewed from a plan view) and two concave portions with different depths are overlapped with a predetermined distance offset in the diagonal direction. formed shape.

[0039] The processing method of the concave portion on the metal plate 6A can adopt a two-stage processing method in which the metal plate is processed with the first mold and the second mold in sequence, and the first mold and the shape and shape of the metal plate 6 of the embodiment 1 are used in the processing. ...

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PUM

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Abstract

A resin-sealed semiconductor device includes a metallic plate and a semiconductor element soldered thereto. The metallic plate has a semiconductor element mounting region formed on one surface thereof and a plurality of squared recesses defined lengthwise and crosswise in the one surface at approximately regular intervals at locations other than the semiconductor element mounting region.

Description

technical field [0001] The present invention relates to a semiconductor device, and more particularly, to a resin-encapsulated semiconductor device for electric power. Background technique [0002] Traditional resin-encapsulated semiconductor devices, as described in Japanese Patent Laid-Open No. Hei 5-235228, solder and fix semiconductor elements on a frame with multiple grooves. The inner grooves can block the solder melted during welding, and the outer grooves can Impurities are prevented from entering through the interface between the molding resin added in the subsequent resin encapsulation process and the frame. However, the above structure cannot control the amount of solder flowing into the groove to a certain level, and cannot guarantee the stability of the thickness of the solder layer. [0003] Another resin-encapsulated semiconductor device, as described in Japanese Patent Application Laid-Open No. Hei 9-92778, provides a die pad for carrying semiconductor eleme...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/50H01L23/12H01L21/60H01L23/433H01L23/48H01L23/495
CPCH01L2224/85205H01L2224/45124H01L2924/0105H01L2924/01082H01L2924/00014H01L2924/01004H01L2224/32245H01L2924/01002H01L2224/27013H01L24/32H01L24/85H01L23/49562H01L2924/01029H01L2224/48472H01L2224/48091H01L2924/014H01L2924/01013H01L2224/32225H01L2224/48225H01L24/45H01L24/48H01L2924/01068H01L2224/48247H01L23/4334H01L2924/01033H01L2924/01006H01L2924/01074H01L2924/01014H01L2224/85009H01L2224/73265H01L2224/83051H01L23/3121H01L23/3142H01L2224/48227H01L2924/181H01L2924/18301H01L2924/351H01L2224/78H01L2924/00012H01L2924/00H01L2924/3512H01L23/48
Inventor 中岛泰石田清鹿野武敏
Owner MITSUBISHI ELECTRIC CORP