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Easily delaminatable laminate and resin composition for use therein

A technology of resin composition and laminated materials, applied in film/sheet-like adhesives, layered products, pressure-sensitive films/sheets, etc., which can solve the problems of difficult-to-reuse substrates, etc.

Inactive Publication Date: 2002-02-20
SUMITOMO CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] When the inventors of the present invention applied energy to irradiate these laminates, it proved that their substrates could be detached, but the adhesive layer was attached to the thus detached substrates, so it was difficult to reuse the thus detached substrates

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0116] The AL plate (A-1) was used as a recycled substrate, and the adhesive (B-1) that can be released when energy was obtained was laminated to one side of the AL plate by the knife coating method with a thickness of 300 μm. The exposure is 400mJ / cm 2 Cured by UV light. (C-4) was laminated to one side of the PC board (A-2) that does not need to be recycled by spin coating in turn, with a thickness of 70 μm, and the obtained adhesive layers (B-1) and (C -4) The surfaces are bonded to each other, followed by a radiation exposure of 400mJ / cm 2 Cured by UV light.

[0117] The bond of the laminate thus obtained is not less than 1 N / mm 2 .

[0118] Laminates prepared in the same manner as above were heated in an oven at 150°C for 5 minutes. When the laminate was removed from the oven, it was found that (A-1) had detached from the laminate with only a small amount of adhesive adhered thereto and was therefore in an easily regenerated state without the need for a regenerated su...

Embodiment 2

[0119] Adhesive (B-1) was laminated to one side of AL plate substrate (A-1) by spin coating with a thickness of 20 μm at a radiation exposure of 400 mJ / cm 2 Under UV curing, a laminate containing (A-1) and (B-1) was obtained. In a similar manner, a laminated material comprising a PC board substrate (A-2) and an adhesive (B-1) was obtained. Subsequently, the surfaces of the adhesives of the two laminates thus obtained were bonded to each other through the adhesive (C-1) with a thickness of 300 μm, and the two laminates were fixed with clips, and then heated at 23° C., 50 %RH, the clamped state was kept for 24 hours, thereby obtaining a laminated material.

[0120] The laminate thus obtained has an adhesive force of not less than 1 N / mm 2 .

[0121] Laminates prepared in the same manner as above were heated in an oven at 150°C for 5 minutes. When the laminate was removed from the oven, it was found that (A-1) had come off the laminate with only little adhesive adhering there...

Embodiment 4

[0129] (B-2) was laminated to one side of (A-1) by knife coating to a thickness of about 70 μm, and cured by keeping the resulting laminate at 23° C., 50% RH for 24 hours. Subsequently, the surface of (B-2) was bonded to (A-2) through (C-1) about 70 μm thick, and the resulting laminate was fixed with clips, and then heated at 23°C, 50% RH, The clamped state was held for 24 hours, thereby obtaining a laminate in which (A-1) / (B-2) / (C-1) / (A-2) was laminated in this order.

[0130] Adhesion tests of the laminate thus obtained demonstrated a tensile strength of 0.5 N / mm 2 It does not fall off, and finally, the adhesive layer of (B-2) has a tensile strength of 4.7N / mm 2 fall off.

[0131] Laminates prepared in the same manner as above were heated in an oven at 150°C for 5 minutes. When the laminate was removed from the oven, it was found that foaming of (B-2) caused (A-1) to fall off the laminate, and the recovered (A-1) had only a small amount of adhesive adhering, so it was in ...

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Abstract

A laminate comprising (A) a substrate, (B) an adhesive which is reduced in adhesiveness upon exposure to a type of energy, to render the laminate to be delaminated with ease, and (C) an adhesive which is not reduced in adhesiveness upon exposure to the type of energy, the three types of materials being laminated in the above order; and a resin composition for use in the laminate comprising an epoxy resin and / or a modified silicone resin and a blowing agent.

Description

technical field [0001] The present invention relates to laminates comprising a substrate and an adhesive. In particular, the present invention relates to laminates with particularly easy release properties, characterized in that they exhibit high adhesion in their application and at the same time when the laminate acquires energy for recycling the substrate, the substrate It is especially easy to release from laminates, and its adhesive layer hardly sticks to the substrate. [0002] The present invention further relates to specific resin compositions as active ingredients in adhesives for forming laminates. Background technique [0003] Laminates are formed by laminating substrates and adhesives, which can be used for various items such as auto parts, home appliances, electronic products, office items, and daily necessities. Recently, there is a need for a method of recovering the substrate from these laminates to recycle the substrate. So far, there have been disclosed l...

Claims

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Application Information

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IPC IPC(8): C09J7/38C09J7/35
CPCC09J7/0207C09J2463/00C09J2483/00C09J7/0203C09J2433/00C09J2201/36C09J2475/00Y02P20/582C09J7/35C09J7/38C09J2301/208C08L63/00
Inventor 藤田真人内藤茂树
Owner SUMITOMO CHEM CO LTD
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