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Electronic device with heat generating parts and heat absorbing parts

A technology of electronic devices and thermal components, applied in semiconductor/solid-state device components, circuits, sports accessories, etc., can solve problems such as increased temperature and unstable operation

Inactive Publication Date: 2002-10-02
SONY COMPUTER ENTERTAINMENT INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The added heat increases the temperature inside the device, which can lead to unstable operation, not only for the CPU, but also for other electronic components

Method used

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  • Electronic device with heat generating parts and heat absorbing parts
  • Electronic device with heat generating parts and heat absorbing parts
  • Electronic device with heat generating parts and heat absorbing parts

Examples

Experimental program
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Embodiment Construction

[0030] Detailed Description of Preferred Embodiments

[0031] A specific embodiment of the present invention will be described below with reference to the drawings. (1) The overall configuration of the device

[0032] Figures 1 to 5 is a structural diagram of a video game device 1, which is an electronic device according to a specific embodiment of the present invention, wherein figure 1 is a perspective view of viewing device 1 from above, figure 2 For viewing the front view of device 1 from the front, image 3 For viewing the rear view of the device 1 from the rear, Figure 4 is an exploded perspective view of the housing 3, and Figure 5 is a perspective view of the interior of the device 1 viewed from above.

[0033] For example, the video game device 1 reads a game program recorded on an optical disc or other media, and executes it according to an instruction from a user (game player). "Executing the game" mainly means to control the progress of the game, as well...

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PUM

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Abstract

An object of the present invention is to provide an electronic device that can effectively cool heat-generating components and can be miniaturized. According to the electronic device of the present invention, a rectangular radiator for absorbing heat of the CPU is arranged in the cooling air suction channel (71) upstream of the power supply unit. By blowing low-temperature cooling air onto the rectangular radiator without containing radiant heat from the power supply unit, the rectangular radiator can be cooled and the heat dissipation of the CPU can be increased. In this way, the CPU can be effectively cooled, so the electronic device can be made smaller in size than previous types of conventional devices.

Description

field of invention [0001] The invention relates to an electronic device, which has a heat-generating component that releases heat, and a power supply unit, which supplies power to the heat-generating component. Background of the invention [0002] Recently, there is an increasing demand for higher-speed communication, other processing capabilities in the CPU (Central Processing Unit), and other video game devices, personal computers and other electronic devices, in order to process a large number of data at a higher speed. multimedia information. [0003] When trying to increase the speed of processing power, the CPU itself generates more heat due to higher speed signal transmission and reception, and more complex wiring in the CPU, which generates more heat in its components . The added heat increases the temperature inside the device, which can lead to unstable operation, not only for the CPU, but also for other electronic components. This leads to a need for electronic...

Claims

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Application Information

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IPC IPC(8): A63F13/98G06F1/20H01L23/467H05K7/20
CPCG06F1/20H01L23/467H01L2924/0002H01L2924/00
Inventor 凤康宏
Owner SONY COMPUTER ENTERTAINMENT INC
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