Method for manufacturing mixed integrated circuit device

Abstract

In a molding process, a hybrid integrated circuit substrate is positionally fixed in a horizontal direction. By abutting the points, where particularly leads having a spacing kept constant continue with a first connection portion, against guide pins provided on a mold die, a hybrid integrated circuit substrate can be positionally fixed. Because the spacing between the particular leads is not relied upon the number of terminals of the hybrid integrated circuit substrate, the mold can be commonly used where the number of terminals is different.

Description

technical field [0001] The present invention relates to a manufacturing method of a hybrid integrated circuit device, and relates to a manufacturing method of a hybrid integrated circuit device in which a resin package is formed on a hybrid integrated circuit substrate by transfer molding. Background technique [0002] Generally, there are mainly two packaging methods for hybrid integrated circuit devices. [0003] The first method is to package with a device in the shape of a lid placed on a hybrid integrated circuit substrate on which circuit elements such as semiconductor devices are mounted, that is, a device generally called a box member. The structure sometimes adopts a hollow structure or a structure in which resin is additionally injected. [0004] The second method is to use injection molding as a molding method for semiconductor ICs. For example, it is shown in JP-A-11-330317. The injection molding method generally uses a thermoplastic resin, for example, a resi...

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Problems solved by technology

This is because Al thin wires are easy to bend, and ultrasonic waves are required for bonding, so the bonding time is long, so it cannot be used.

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