Mixed integrated circuit device and its manufacturing method

Abstract

In a molding process, a hybrid integrated circuit substrate is fixed the position of the substrate in a thickness direction. A leadframe is connected, with an upward inclination, to a hybrid integrated circuit substrate and transported into a mold cavity. By horizontally fixing the leadframe by mold dies, the hybrid integrated circuit substrate inclined upward is urged downward by a pushpin. This can fix the position of the hybrid integrated circuit substrate within the mold cavity and integrally transfer-molded.

Description

technical field [0001] The present invention relates to a hybrid integrated circuit device and its manufacturing method, and relates to a hybrid integrated circuit device in which a resin package is formed by transfer molding on a hybrid integrated circuit substrate and its manufacturing method. Background technique [0002] Generally, there are mainly two packaging methods for hybrid integrated circuit devices. [0003] The first method is to package with a device in the shape of a lid placed on a hybrid integrated circuit substrate on which circuit elements such as semiconductor devices are mounted, that is, a device generally called a box member. The structure sometimes adopts a hollow structure or a structure in which resin is additionally injected. [0004] The second method is injection molding, which is a molding method of semiconductor ICs. For example, it is shown in JP-A-11-330317. The injection molding method generally uses a thermoplastic resin, for example, a...

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Problems solved by technology

This is because Al thin wires have poor elasticity and are easy to bend. Ultrasonic waves are required for bonding, so the bonding time is long, so it cannot be used.

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