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Flexible printing circuit board adhesive

A technology of adhesives and compositions, applied in the direction of adhesive types, adhesives, epoxy resins, etc., can solve problems such as poor applicability of circuit boards

Inactive Publication Date: 2003-04-02
TAIFLEX SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Using onium hexafluoroantimonate as a hardening accelerator, the present invention can provide an adhesive with a high glass transition temperature (140°C-170°C) and a long storage period (more than 50 days) at room temperature, so it can solve the problem of the current cover film Encountered the problem of poor applicability of the circuit board due to the high instability of the adhesive in use

Method used

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  • Flexible printing circuit board adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Step 1: Preparation of Solution I

[0036] A-1 50g

[0037] A-2 50g

[0038] C 100g

[0039] D 20g

[0040] Methyl ethyl acetone (MEK) 210g,

[0041] After mixing, grind with a grinder for four hours.

[0042] Step 2: Preparation of Solution II (Hardening Accelerator)

[0043] B-1 2g

[0044] Methyl ethyl acetone (MEK) 12g

[0045] Step 3: Mix the formulation I and the formulation II at a weight ratio of 1:1, and then grind with a grinder for one hour. Obtain a binder solution of 50% by weight.

Embodiment 2

[0047] The step of preparing adhesive is identical with example 1, but changes the hardening accelerator in the dosing II into 2g of hexafluoroantimonic acid (tetra-methoxybenzyl) (one-naphthylmethyl) sulfonium salt (B- 2).

Embodiment 3

[0049] The steps for preparing the adhesive were the same as in Example 1, but the hardening accelerator in the formulation II was changed to 2 g of methyl(tetra-hydroxybenzyl)benzylsulfonium hexafluoroantimonate (B-3).

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PUM

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Abstract

An adhesive for flexible PCB contains epoxyresin, hardening promoter, carboxy contained nitrile rubber, and inorganic filler (aluminium hydroxide).

Description

technical field [0001] The present invention relates to a kind of adhesive with high glass transition temperature (Tg) and longer storage period, which is a composition comprising epoxy resin, hardening accelerator, carboxyl-containing nitrile rubber and inorganic filler, etc., mainly Applied to flexible printed circuit boards. Application of the invention can improve the application range and processability of the flexible printed circuit board. Background technique [0002] Flexible printed circuit board (Flexiblc Printed Circuit, FPC), also known as flexible printed circuit board, because of its flexibility and bending characteristics, it can be three-dimensional with the size and shape of the space available for the product. Wiring. In recent years, various high-tech equipment, such as cameras, video cameras, audio equipment, disk drives, printers, and mobile phones, have gradually developed towards light, thin, short, and small. Therefore, flexible printed circuit Th...

Claims

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Application Information

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IPC IPC(8): C09J163/00
Inventor 林辅乐陈锦屏洪子锦黄松甄游国华夏国雄刘延治
Owner TAIFLEX SCI
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