Packaging component for semiconductor chip

Abstract

The present invention relates to a package of semiconductor chip, including a substrate and a chip placed on the substrate. On the chip at least a power supply wire and a grounding wire are set, and on the surface of the chip at least a capacitor is set, said capacitor is electrically connected to power supply wire and grounding wire, and the capacity of the capacitor is above microfared level, said capacitor is fixed on the surface of the chip by using conductive adhesive or using tin soldering. Its conduction path is short, so that it can prevent voltage drop, and can effectively filter noise signal.

Description

(1) Technical field [0001] The invention relates to a semiconductor chip, in particular to a semiconductor chip package with capacitors embedded on the surface of the chip, so as to improve the electrical performance of the semiconductor chip. (2) Background technology [0002] With the development of semiconductor process technology, hundreds of thousands or even millions of transistors are often built in an integrated circuit. If these transistors are in working state at the same time, such as being turned on or off at the same time, it will cause instantaneous pulse effect and noise to the power supply, which will make the operation result of the integrated circuit in an uncertain state. [0003] In order to solve the voltage regulation and noise problems of the power supply, the existing method is to add several capacitors on the circuit board connected to the integrated circuit. Such as figure 1 As shown, it is a perspective view of the plastic ball array package. The...

AI Technical Summary

Problems solved by technology

However, this patent can only use die-level capacitors, and its capacitance value is only about a few hundred pico Farads (picoFarad), which is quite limited in comparison.

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