Interlayer connection of multi-layer electronic component and mfg. method thereof

Abstract

An interlayer connection method for multi-layer electronic device includes preparing a conic salient point on electrode in advance, covering a layer of ceramic slurry by "dead-weight cast casting" method, baking to form a film, removing the film from the top of said salient point to expose it, and using the exposed top to connect the electrodes on upper and lower layers to each other. Its advantages are plane connection for high reliability, no stress between electrode and ceramics, and low cost.

Description

Technical field: [0001] The invention relates to an interlayer connection and a manufacturing method of a multilayer electronic component. Background technique: [0002] With the development of electronic technology, electronic components are increasingly miniaturized, chip-shaped, and composite. Many electronic components adopt multi-layer manufacturing technology, such as laminated inductors, transformers, filters, magnetic beads, etc., so that the electronic components need to solve the problem of interlayer connection of wires or electrodes during the manufacturing process. [0003] At present, there are three main methods of interlayer connection commonly used at home and abroad: (1) printing connection method; (2) punching method; (3) wet process. [0004] (1), printing connection method [0005] Print the conductive paste pattern on the ceramic substrate, the length of the conductive paste is about 1 / 2 of the length of the ceramic substrate, and then print the ceram...

AI Technical Summary

Problems solved by technology

This method has the following defects: a) due to the large number of printing times, the production efficiency is low; b) it is difficult to adjust the thickness of the printing layer; pulp breaks here

This method has the following defects: a) due to the fact that the process needs to laminate the ceramic film, defects such as cracks, air bubbles, and pores will occur during the lamination process; b) because the electrode material shrinks more than the ceramic material during sintering, In the sintering process, interlayer connection fractures are prone to occur; c) Although this method is easy to automate production, the production equipment requires high precision and expensive equipment; d) Due to the need to punch holes, the miniaturization of the product size will be affected by the size of the holes. restricted

This method has the following defects: a) poor consistency, due to the inconsistency in the size of the printed Via electrodes, the ceramic slurry cannot be completely discharged from the top of the part of the Via, so that through holes cannot be formed on the top of the part of the Via; b) due to incompatibility , pinholes are prone to appear; c) Via connection cannot be formed for thicker ceramic paste; d) In the formed through hole, the Via point is lower than the ceramic surface, and a hole will appear, so that the top electrode cannot fill the hole by printing full of pores

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