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Circuit-board having internal electronic element and making method thereof

A technology of electronic components and circuit boards, which is applied in the field of circuit boards installed with internal electronic components and its manufacturing field, can solve the problems of damage to heat dissipation efficiency, difficulty, and difficulty in complete coverage, and achieve the effect of improving connection reliability

Inactive Publication Date: 2003-08-27
SHARP KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is difficult to completely cover the inner wall of the through hole 403
In order to increase wiring density, it is also difficult to form small-diameter via holes with this structure and provide them in multi-layer signal wiring layers
Even when multiple signal wiring layers are provided, the film layer provided between the electronic component 104 and the metal core substrate 401 will significantly impair the heat dissipation efficiency

Method used

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  • Circuit-board having internal electronic element and making method thereof
  • Circuit-board having internal electronic element and making method thereof
  • Circuit-board having internal electronic element and making method thereof

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0066] 1A to 1G are cross-sectional views illustrating process steps of a manufacturing method of a circuit board 100 mounted with built-in electronic components (hereinafter referred to as "circuit board 100 mounted with built-in electronic components") according to a first embodiment of the present invention. FIG. 1G shows the completed state of the circuit board 100 mounted with built-in electronic components.

[0067] As shown in Figure 1G, the circuit board 100 that is installed with built-in electronic components includes: flat core (support plate) 1, the wiring pattern 3 that is arranged on the flat core 1, and various electronic components 3 that are arranged on the flat core 1 . In this embodiment, two electronic components with different heights are arranged on the flat core 1 . The electronic components 3 are arranged on the surface of the flat core 1, but not in the wiring figure 2 within the area.

[0068] The circuit board 100 mounted with built-in electronic...

example 2

[0086] Figure 4 is a sectional view illustrating the structure of a circuit board mounted with built-in electronic components according to a second embodiment of the present invention. In the first embodiment, the insulating layer 15 is provided on the entire surface of the flat core 1 . In the second embodiment, the insulating layer 15 is provided only on the electronic component 3 and the necessary area of ​​the flat core 1, and the insulating layer 30 made of a resin plate is provided in the remaining area of ​​the flat core 1.

[0087] Due to such a structure, the production cost of the circuit board on which the built-in electronic components are mounted can be reduced. and increase its rigidity. When the circuit board mounted with built-in electronic components is punched along the line of the isolation layer 30, the desired shape can be obtained without cracks.

example 3

[0089] Figure 5 is a sectional view illustrating the structure of a circuit board mounted with built-in electronic components according to a third embodiment of the present invention. In the first embodiment, both sides of the electronic component 3 have connection lead-out terminals. In the third embodiment, an electronic component 3 has a plurality of connection terminals 4 on one surface, and can be formed into substantially the same shape as a BGA package without punching.

[0090] Electronic components 3 having such a shape are provided on the flat core 1 . Like the first embodiment, through the openings 12 formed in the insulating layer 15, the connection terminals 4 and the wiring patterns 14 are respectively connected to each other. In the third embodiment, there are a plurality of connection portions between the connection terminal 4 and the wiring pattern 14 .

[0091] In this embodiment, the diameter of each connection portion from the connection terminal 4 to t...

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PUM

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Abstract

A built-in electronic component-mounted wiring board includes an electronic component having a connecting terminal and being mounted on a support; an insulating layer provided on the support so as to cover at least a portion of the electronic component; an opening provided in the insulating layer so as to expose the connecting terminal of the electronic component; and a connecting portion provided in the opening.

Description

technical field [0001] The invention relates to a circuit board used in an electronic device, in particular to a circuit board installed with built-in electronic components and a manufacturing method thereof. Background technique [0002] Figure 15 is a cross-sectional view of a general printed circuit board 110 provided with electronic components 104 . [0003] The printed circuit board 110 includes a support plate 101 and a conductive pattern 102 made of insulating resin. The conductive pattern 102 is formed by forming a conductive layer such as copper foil on the support plate 101 and etching the conductive layer. The printed circuit board 110 has a solder resist layer 103 provided on the support board 101 and on the conductive pattern 102 . On the conductive pattern 102, except for the area where the solder layer 103 is not required to be electrically or physically connected with the electronic component 104 or other components, or for other r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/538H05K1/18H05K3/46
CPCH01L2924/01015H01L2224/24226H01L2924/01023H01L2224/24227H01L2924/01082H01L2924/01004H01L2924/30105H01L2224/16H01L24/82H01L2224/82047H01L2924/01029H01L2924/19041H01L24/24H01L2924/01013H01L2924/014H01L2924/30107H01L2224/32225H01L2224/82039H01L2924/19043H01L2224/73267H01L2224/04105H01L2924/14H01L2924/01033H01L2924/01005H01L2924/19042H01L2924/01006H05K1/185H01L2924/01078H01L2924/01075H01L2924/3025H01L23/5389H01L2223/6677H01L2224/0401H01L2924/12042H01L2924/00
Inventor 上野幸宏
Owner SHARP KK
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