High speed simulation method of ion implantation including dose effect
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- PEKING UNIV
- Publication Date
- 2003-10-15
- Estimated Expiration
- Not applicable · inactive patent
Smart Images
Figure 1 Figure 2 Figure 3
Abstract
Description
Technical field:
[0001] The invention belongs to the technical field of integrated circuits, and in particular relates to an ion implantation simulation method including dose effects. Background technique:
[0002] At present, the feature size of integrated circuits is continuously shrinking, and it is expected to reach 50 nanometers around 2010. The formation of ultra-shallow junction is one of the key technologies of ultra-deep submicron devices. As a mature key process of integrated circuits, ion implantation has irreplaceable value. Therefore, ultra-low energy ion implantation and annealing technology has always been a research hotspot. one. The disadvantage of ion implantation and annealing lies in the enhancement of diffusion, which has become the key to restrict ultra-shallow junction technology; the method of simulation is an effective way to study its mechanism, so the implantation simulation of atomic model has received great attention in the world. The reason fo...