Rareearth lead based grid alloy and mfg. process thereof
A preparation process and alloy technology are applied in the field of rare earth lead substrate grid alloy and its preparation process, which can solve the problems of high environmental damage, high price, inability to improve strength and corrosion resistance at the same time, and achieve improved mechanical properties and specific energy. , the effect of improving electrochemical performance
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Embodiment 1
[0008] Example 1: First, 0.02% by weight of Y, 1.2% of Sn and 98.76% of Pb are smelted at 650°C; then, after each element is melted, 0.02% by weight of Ca is added in the alloy melt; finally, after the Ca is completely melted, the alloy liquid is poured into the metal fast cooling mold, and the cooling rate of the alloy liquid is controlled at 10 2 The k / s can be cooled to room temperature. The rare earth lead substrate gate alloy prepared according to the preparation process of this embodiment contains: 0.02% Ca, 1.2% Sn, 0.02% Y and 98.76% Pb.
Embodiment 2
[0009] Example 2: First, 0.06% by weight of Ce, 0.4% of Sn and 99.45% of Pb are smelted at 400°C; then, after each element is melted, 0.09% by weight of Ca is added by pressing method in the alloy melt; finally, after the Ca is completely melted, the alloy liquid is poured into the metal fast cooling mold, and the cooling rate of the alloy liquid is controlled at 10 5 The k / s can be cooled to room temperature. The rare earth lead substrate gate alloy prepared according to the preparation process of this embodiment contains: 0.09% Ca, 0.4% Sn, 0.06% Ce and 99.45% Pb.
Embodiment 3
[0010] Example 3: First, 0.04% by weight of La, 0.8% of Sn and 99.11% of Pb are smelted at 450°C; then, after each element is melted, 0.05% by weight of Ca is added in the alloy melt; finally, after the Ca is completely melted, the alloy liquid is poured into the metal fast cooling mold, and the cooling rate of the alloy liquid is controlled at 10 3 k / s can be cooled to room temperature, and the rare earth lead substrate gate alloy prepared according to the preparation process of this embodiment contains: 0.05% Ca, 0.8% Sn, 0.04% La and 99.11% Pb.
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