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Manufacture of laser-burnt multilayered circuit board

A technology of a multilayer circuit board and a manufacturing method, applied in the direction of multilayer circuit manufacturing, etc., can solve problems such as deviation from the characteristics and efficacy of the invention

Inactive Publication Date: 2003-11-05
UNITECH PRINTED CIRCUIT BOARD CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As far as the current professional manufacturing technology of circuit boards is concerned, there are many different manufacturing methods to make multilayer circuit boards that can be conducted between layers, and each manufacturing method has specific manufacturing steps, and Each configuration is produced with a complete set of production equipment, which is sufficient to achieve the economic benefits of the manufacturing method. In other words, the individual steps in the manufacturing method are separately configured and completed with specific equipment, and then the individual specific equipment is combined to form a complete set of equipment. Consistently complete the entire production method; therefore, once the individual steps included in the manufacturing method are set, even if the process used in the individual steps can be replaced by other known processes, there is no way to replace it, otherwise it will deviate from the original nature of the production method Invention Features and Effects

Method used

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  • Manufacture of laser-burnt multilayered circuit board
  • Manufacture of laser-burnt multilayered circuit board
  • Manufacture of laser-burnt multilayered circuit board

Examples

Experimental program
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Embodiment Construction

[0025] See first figure 1 The present invention is by each manufacture step as described below, hereby it is described as follows:

[0026] (1a), the dielectric material 2 of dry film or printing ink is coated on a substrate 1 with copper surface circuit 11:

[0027] (1b), then bake the dielectric material 2, so that the dielectric material 2 can be polymerized and molded on the substrate 1;

[0028] (1c), and then use the abrasive belt or brushing method to level the dielectric material 2, so that the dielectric material 2 has better flatness, so that the surface of the final product will not have unevenness, and the surface is clean and rough surface effect, to improve the bonding of the upper copper surface circuit 4;

[0029] (1d), then burn and melt the connection point on the dielectric material 2 to form a hole with the laser beam 3, so that the copper surface circuit 11 on the substrate is exposed;

[0030] (1e), finally metallize and electroplate on the surface of ...

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Abstract

A preparing method is featured as the follows. A dielectric material of dry film or oil ink is coated on a base plate with copper face circuit and to have the dielectric material polymerization-formed on the base plate by baking. The sand belt or grinding brush is applied for levelling process of the dielectric material to let the finally formed circuit board face have better evenness but with coarse effect to raise its combinability. The electric light shooting beam is used to scorify holes at connection points of the diectric material to expose copper face circuit on the base plate. An upper layer copper circuit is formed by electroplating, chemical etching and face metallizing of the dielectric material and a multilayer circuit board with interlayer conduction can be obtained by conducting two copper circuits.

Description

technical field [0001] The invention relates to a method for manufacturing a multilayer circuit board, in particular to a method for manufacturing a laser direct burning multilayer circuit board. Background technique [0002] Over the years, in order to achieve light, thin, and short design goals for electrical appliances, the circuit boards used in electrical appliances have developed to a multi-layer circuit board structure that can be conducted layer by layer. As far as the current professional manufacturing technology of circuit boards is concerned, there are many different manufacturing methods to make multilayer circuit boards that can be conducted between layers, and each manufacturing method has specific manufacturing steps, and Each configuration is produced with a complete set of production equipment, which is sufficient to achieve the economic benefits of the manufacturing method. In other words, the individual steps in the manufacturing method are separately conf...

Claims

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Application Information

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IPC IPC(8): H05K3/46
Inventor 周政贤
Owner UNITECH PRINTED CIRCUIT BOARD CORP
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