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Hybrid phenol-formaldehyde and isocyanate based resins

A technology of phenolic resin and hybrid resin, applied in the field of adhesives

Inactive Publication Date: 2003-11-12
BAYER AG +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Other disadvantages of production in production plants are the huge capital investment associated with the presses and associated equipment including steam generation equipment for heating in the compression process

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0075] Phenyl acetate and aniline were combined in approximately equimolar amounts in the reaction vessel. The temperature was raised to 121 °C for 5 minutes to simulate the interior of an oriented particle board during hot pressing. Acetanilide, the product of the action with aniline, was identified as the major reaction product, demonstrating that under these conditions the PF moiety was activated towards condensation and reaction with the isocyanate component.

Embodiment 2

[0077] Acetylated PF resin prepared by treating commercial PF resin (trade name AcmeFlow(R) 2012) with acetyl chloride and triethylamine was combined with commercial polymeric MDI resin. Combinations of weight ratios of 10%, 25% and 33% acyl PF (remainder being polymeric MDI) resulted in clear homogeneous solutions with no significant increase in viscosity over the 2 week test period.

Embodiment 3

[0079] A mixture of 30 wt% PF / 70 wt% pMDI and 0.25 mol equivalent water / NCO was heated at 121°C. Samples were collected after 5 minutes and 8 minutes, where at 8 minutes the mixture was a soft gel-like mass. The material was removed from the heat source and after 2-3 minutes the sample appeared to be a single phase hard solid. This example is consistent with the co-reactivity of the two resins.

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PUM

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Abstract

Hybrid resins formed of an acylated phenol-formaldehyde (PF) resin and a polymeric phenyl isocyanate (pMDI) resin have extended shelf stability, yet cure at a rate faster than any of its components when used in conventional flakeboard, strandboard or other board making processes.

Description

technical field [0001] The present invention relates generally to the field of adhesives, and more particularly to adhesives useful in the field of forest products such as plywood, chipboard, waferboard, strandboard, and the like. Methods of synthesis, resulting adhesives and methods of using the adhesives are within the scope of the present invention. Background technique [0002] Forest products, especially products made into useful materials by using adhesives, are generally known. Chipboard, curl board, oriented particle board, plywood and other composite materials made by adding adhesives to forest products or by-products are well-established products. Typically, the binder includes a phenolic (PF) resin. Another commonly used resin is liquid polymethylene poly(phenylisocyanate) (pMDI). Although aqueous alkaline phenolic resins exhibit good durability, relatively low cost and relatively low toxicity, they are known to have slower pressing times ...

Claims

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Application Information

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IPC IPC(8): B27N1/02B27N3/00B27N3/02C08G8/28C08G18/54C08G18/64C08G18/76C08L61/06C08L61/10C08L61/14C09J161/06C09J175/04
CPCC08G18/7664C08L61/14C08G8/28B27N3/002C08L61/06C08G18/6492C08G18/542C08L75/04
Inventor 托德·R·米勒刘易斯·D·克里尔威廉·D·德特勒夫森
Owner BAYER AG
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