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Surface acoustic wave device, method of manufacturing the device, and electronic component using the device and method

A technology of surface acoustic wave and manufacturing method, applied in the direction of electric solid devices, electrical components, semiconductor devices, etc., can solve problems such as electrostatic discharge, deterioration, and resistance increase, and achieve the effect of reducing device damage and reducing inhomogeneity

Inactive Publication Date: 2003-12-31
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in the prior art, short-circuiting thin wires of metal thin films around the interdigitated electrodes and grid reflector electrodes are provided inside the cutting line, and many short-circuit thin wires and interdigital electrodes are provided to electrically connect these metal thin films. In the structure of thin wires, when there are many charges generated or the distance between electrodes is narrow, and the distance between connected electrodes is large, the short-circuit thin wire connecting the metal thin film and the interdigitated electrode are very thin. If the connecting wire is bent or part of the wire is thinner than other parts, etc., the resistance between the wires becomes larger, and the generated charge cannot be sufficiently neutralized and uniformized, resulting in electrostatic discharge between the electrodes. , causing electrode damage or deterioration of electrical characteristics

Method used

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  • Surface acoustic wave device, method of manufacturing the device, and electronic component using the device and method
  • Surface acoustic wave device, method of manufacturing the device, and electronic component using the device and method
  • Surface acoustic wave device, method of manufacturing the device, and electronic component using the device and method

Examples

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Embodiment 1

[0041] The inventions No. 1 to No. 5, No. 8, and No. 10 to No. 15 of the present invention will be described below using Example 1.

[0042] figure 1 It is a plan view showing the electrode pattern of the surface acoustic wave device 10A in Embodiment 1 of the present invention, and FIG. 2 shows that a plurality of figure 1 Top view of the electrodes of the surface acoustic wave device in . and image 3 is used figure 1 A cross-sectional view of an electronic device 40A fabricated by encapsulating the surface acoustic wave device 10A.

[0043] Among them, 1 is a substrate with piezoelectric characteristics, 2 is a comb-shaped electrode, 3 is a reflector electrode, 4a is an input terminal lead-out electrode, 4b is an input terminal electrode, 5a is an output terminal lead-out electrode, 5b is an output terminal electrode, 6a, 6b is an auxiliary electrode with different widths in different parts that are electrically independent from each other, 7 is a bump, 8 is a part betw...

Embodiment 2

[0090] The inventions of items 1 to 7 and items 10 to 15 of the present invention will be described below using Embodiment 2 of the present invention.

[0091] Figure 4 It is a plan view showing an electrode pattern of a surface acoustic wave device 10B in Example 2 of the present invention. exist Figure 4 In, all with embodiment 1 in figure 1 The same parts in all use the same number, and detailed descriptions are omitted. in addition, Figure 4 It is a schematic diagram showing the structure of the second embodiment, and does not show the relative relationship between the dimensions.

[0092] In this embodiment 2 Figure 4 and this embodiment 1 figure 1 The difference is: the reflector electrode 3 and the auxiliary electrodes 6a, 6b which are electrically independent and have different widths in different parts are electrically connected by a plurality of strip electrodes 17, and three comb-shaped electrodes 2 are provided respectively. The comb-shaped electrode 2 a...

Embodiment 3

[0101] The following uses embodiment 3 of the present invention to illustrate items 1 to 5 and items 9 to 15 of the present invention.

[0102] Figure 5 It is a plan view showing an electrode pattern of a surface acoustic wave device 10C in Example 3 of the present invention. Figure 5 Among them, all the same as in Example 1 figure 1 The same part in all uses the same number, and detailed description is omitted. In this embodiment 3 Figure 5 and in this embodiment 1 figure 1 The difference is that the reflector electrode 3 is formed of a curved line, and the reflector electrode 3 and the comb-shaped electrode 2 are electrically connected. in addition, Figure 5 It is a schematic diagram showing the structure of the third embodiment, and does not show the relative relationship between the dimensions.

[0103] In Embodiment 1, the comb-shaped electrodes 2 and the reflector electrodes 3 are electrically disconnected, while in the present embodiment 3 the comb-shaped elec...

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Abstract

The present invention provides a surface acoustic wave device, wherein comb electrodes (2) and reflector electrodes (3) are surrounded by a plurality of auxiliary electrodes (6a, 6b) electrically independent of each other and having different widths according to the positions thereof, whereby a charge generated by the pyroelectricity of a substrate (1) with a piezoelectricity can be electrically uniformized efficiently.

Description

technical field [0001] The present invention relates to a surface acoustic wave device used in communication equipment, a manufacturing method thereof, and an electronic device using the same. Background technique [0002] The conventional surface acoustic wave device is formed by forming a metal thin film on the entire surface of a substrate with piezoelectric properties, coating a resist layer on it, exposing to light, developing, and then forming interdigitated electrodes ( Inter digital Transducer), grating reflector electrodes (GratingReflector), cutting lines around them, and thin lines connecting these desired electrode patterns, and then cut along the cutting lines to obtain a monolithic surface acoustic wave device. [0003] In this method, once the surface acoustic wave device is cut from the substrate with piezoelectric properties, since the electrical connection between the interdigitated electrodes and the grid reflector electrodes is disconnected, when the sur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H3/08H03H9/02H03H9/25H03H9/64
CPCH03H9/25H03H9/6463H03H9/02921H03H9/02913H03H3/08H03H9/059H03H9/6433H03H9/1071H03H9/6473H01L2224/05568H01L2224/05573H01L2224/16225H01L2924/16195H01L2224/05624H01L2924/00014H01L2224/05647H01L2224/05655H01L2224/05666H01L2224/05671
Inventor 池田和生西村和纪村濑恭通
Owner PANASONIC CORP