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Condenser microphone assembly

A technology for microphones and components, applied in the field of microphones, can solve the problems of difficult cost, poor audio and reliability characteristics, and affecting audio characteristics of condenser microphones.

Inactive Publication Date: 2004-02-25
SHURE INC (US)
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the surrounding membrane before the probe transducer can affect audio characteristics such as signal-to-noise ratio, frequency response, and sensitivity
[0007] It is extremely difficult and expensive to form a complete condenser microphone through MEMS process
Additionally, condenser microphones formed entirely from MEMS processes often exhibit poor audio and reliability characteristics

Method used

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  • Condenser microphone assembly
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Embodiment Construction

[0022] refer to figure 1 with 2 , in the preferred embodiment, the present invention includes a film or membrane 10 separate from the back plate 12 . The diaphragm 10 is flexible and exposed to air. A protective grille (not shown) may be mounted over the diaphragm 10 . Diaphragm 10 is made of materials known for the construction of microphone diaphragms, such as metal films or metallized polymer films.

[0023] Backplane 12 is rigid or fixed. Integrally formed with the back plate 12 are spacers, such as in figure 1 is shown at reference numeral 14, and in figure 2 is shown at 15. The diaphragm 10 is separated from the back plate 12 by a narrow air gap 13 (only in figure 2 shown in ), the air gap is defined by spacers 14,15. The backplane 12 and the spacers 14 are manufactured, for example, from a semiconductor material, such as silicon, by batch processing techniques. refer to figure 1 The top region 28 of the spacer 14 comprises a layer of electrically insulating ...

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Abstract

A microphone assembly comprising a housing (20), the housing (20) including an upper lip (18), a silicon backplate (12), a silicon spacer (14, 15) integrally formed with the backplate and comprising at least one protrusion and an insulating layer (30), such as silicon dioxide or a fluoropolymer. A single diaphragm (10) having a metallized polymer film, acting as both a protective environmental barrier and a sensing electrode of a capacitive electroacoustic sensing transducer.

Description

technical field [0001] The present application relates to a microphone, and more particularly to a condenser microphone assembly, such as a backplate made of semiconductor devices with an integral spacer. Background technique [0002] Condenser or condenser microphones are widely used in the audio, electronics and instrumentation industries. A condenser microphone includes a flexible diaphragm or membrane, and a rigid backplate that includes one or more openings. Together, the membrane of the microphone and the backplate form a capacitor, which is also called a condenser. When sound waves hit the membrane, the membrane moves, causing the height of the air gap between the membrane and the backplate to change. This change in gap causes a change in the capacitance of the capacitor formed by the film and backplate. If a fixed or controlled charge Q is maintained on the capacitor, a voltage will develop across the capacitor which will vary in proportion to the change in air ga...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R1/02H04R17/02H04R19/04
CPCH04R19/005H04R19/04
Inventor 凯利·Q·凯马克·W·吉尔伯特
Owner SHURE INC (US)