Cushioning body for glass substrate and packing body using the cushioning body

Abstract

A cushioning body for glass substrate having an L-shaped section and the thickness of the L-shaped section at the end part larger than the thickness thereof at the corner part, wherein (1) the thickness of the cushioning body is gradually decreased from the end part to the corner part of the L-shaped section with the bottom part of a fixture guide groove taken as a reference by forming the fixture guide groove so that the depth thereof is gradually increased from the end part to the corner part of the L-shaped section, (2) the cushioning device is formed so that the thickness of the cushioning body itself is gradually decreased from both end parts to the corner part of the L-shaped section without forming the fixture guide groove, and (3) a projected part is formed at both outer end parts of the L-shaped section of the cushioning body, whereby a fixture tightening force is prevented from being concentrated to the corner part when the cushioning body is tightened with a fixture.

Description

technical field [0001] The present invention relates to a buffer body for protecting glass substrates, including a glass substrate having electronic parts such as semiconductor devices formed thereon, from damage due to vibration during transportation. The present invention also contemplates a packaged product, wherein a plurality of the above-mentioned glass substrates are packaged together. Background technique [0002] In recent years, electronic or electrical devices, especially liquid crystal displays or plasma displays as a peripheral device for personal computers, and portable terminal devices represented by mobile phones, have developed along with the development of the information technology industry represented by the Internet. Became a device for a surge in production. There is a keen desire to develop technologies related to cushioning bodies for packaging or shipping these devices. Regarding the device, a glass substrate having electronic parts formed thereon ...

AI Technical Summary

Problems solved by technology

In particular, from the viewpoint of saving labor, automatic packaging equipment and unsealing equipment have been introduced recently, but the above-mentioned problems are prone to failure, and it has been pointed out that the L-shaped buffer body is actually not suitable for automation

[0007] Furthermore, there is another problem that fine wear marks may be generated on the surface of the glass substrate due to frictional resistance as the glass substrate is inserted into the substrate insertion groove.

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