Preliminary forming device, preliminary forming method using the device, and main forming method

A technology of pre-forming and forming die, applied in the direction of coating, etc., can solve the problems of quality obstacles of formed parts, reduced production efficiency, reduced pressure, etc., to achieve the effect of easy implementation and improved production efficiency

Inactive Publication Date: 2004-09-01
今井邦雄
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Since injection molding cannot be performed during preforming, the overall production efficiency is reduced
In addition, in order to carry out vacuum forming, it is necessary to form a hole for air discharge in the injection mold, and there is also a disadvantage that the pressure in the mold decreases due to the thickness of the film, which hinders the quality of the molded product.

Method used

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  • Preliminary forming device, preliminary forming method using the device, and main forming method
  • Preliminary forming device, preliminary forming method using the device, and main forming method
  • Preliminary forming device, preliminary forming method using the device, and main forming method

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Embodiment Construction

[0045] The present invention will be further described below with reference to the accompanying drawings. First, refer to Figure 1-8 , the first embodiment of the present invention will be described.

[0046] elephant Figure 1 ~ Figure 3 As shown, the forming system 1 of the present invention comprises a main forming device 2 and a preforming device 3 . The preforming device 3 forms and presses the roll-shaped patterned film 4 to produce a formed film 5 inserted into the main forming device 2 and used.

[0047] The main forming device 2 comprises a mold fastening device 11 and an injection device 16 . In addition, the die fastening device 11 includes a movable platen 11a slidable by four rods 11c, and a fixed platen 11b facing the movable platen 11a. A movable mold 12 and a fixed mold 13 as main molding molds are attached to the movable platen 11a and the fixed platen 11b, respectively, and main molding as injection molding is performed between the movable mold 12 and th...

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Abstract

A preliminary forming device capable of efficiently applying a pattern even on a deep-drawn or a complicatedly shaped formed product without applying any special working on an existing metal mold of a main forming device, a preliminary forming method using the preliminary forming device, and a main forming method; the preliminary forming device, comprising a film feeder (25) feeding a film with pattern (4) to a preliminary forming part (F) for performing a preliminary forming, a heater (30) movable closely to and away from the preliminary forming part and heating the film with pattern before the preliminary forming so as to be plasticized at the preliminary forming part (F), a preliminary forming mold (22) for preliminarily forming the film with pattern, and a film feeder (50) to feed a forming film for releasing the film from the mold after the preliminary forming of the film with pattern and inserting the film into a main forming mold, wherein, after the forming film is inserted into the main forming mold, resin is fed to provide a formed product with pattern, the preliminary forming being performed by vacuum forming or compressed air forming.

Description

technical field [0001] The present invention relates to a preforming device, a preforming method using the device, and a main forming method, which supply resin into the main forming die by mounting a patterned film on the main forming die of the main forming device, in order to A patterned shaped article is obtained to produce a shaped film. That is, the present invention is used for main molding such as so-called insert molding in which a patterned sheet itself is closely attached to the surface of a product, or a so-called residue molding method in which a pattern in a patterned sheet is transferred to the surface of a product. Preforming device used in the method and preforming using the device. Background technique [0002] Conventionally, the method described in JP-A-8-25414 has been known as a residue forming method capable of rationalizing the waste of the transfer film and the like. According to the technique described in this gazette, a part of the mold for injec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C45/14B29C51/10B29C51/44
CPCB29C51/44B29C2045/1404B29C2795/002B29C2791/001B29C2045/14237B29C51/10B29C45/14
Inventor 今井邦雄
Owner 今井邦雄
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