Functional module with built-in radiating fin

Abstract

The present invention provides a functional module with built-in radiating fin. It includes a first circuit board, a second circuit board and a radiating fin, in which the first circuit board has a first surface, on the first surface a first grounding layer is set, the second circuit board is coupled with the first circuit board, and has a second surface which is opposite to the first surface, and on the second surface a second grounding layer is set, the radiating fin is placed between the first circuit board and second circuit board in the mode of that said radiating fin is respectively connected with first grounding layer and second grounding layer.

Description

technical field [0001] The invention relates to a functional module, in particular to a functional module with built-in cooling fins. Background technique [0002] With the advancement of semiconductor manufacturing technology, the operation speed of electronic components is getting faster and faster, and more functions are integrated into a single component, thus causing design difficulties in component heat dissipation, signal quality, and electromagnetic radiation prevention and control. [0003] Generally speaking, electronic components are usually connected to each other through circuit boards. Please refer to figure 1 , in the computer system 10, central processing unit (CPU) 1, chipset (Chipset) 2, graphics processor (CPU) 3 or graphics interface (AGP) 3, and electronic components such as dynamic random access memory (DRAM) 4 All are arranged on the motherboard 7 made of printed circuit boards, and are arranged in different areas on the motherboard. The above-mentio...

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Problems solved by technology

[0005] In order to effectively solve the heat dissipation problem of these high-heating components on the motherboard at the same time, the above-mentioned solutions can no longer meet such heat dissipation requirements, so more effective heat dissipation methods and heat dissipation components must be introduced

However, these more effective heat dissipation elements are usually only suitable for flat surfaces. The problem of each high heating element on the

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