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Semiconductor device and its manufacturing method

A technology for semiconductors and devices, applied in the field of semiconductor devices and their manufacturing, can solve problems such as rising and undisclosed heat dissipation performance, and achieve the effects of improving reliability, ensuring assembly accuracy, and improving heat dissipation performance

Inactive Publication Date: 2004-12-01
FUJI ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0019] However, none of the above-mentioned documents disclose detailed techniques for providing a high-performance semiconductor device as a whole by improving heat dissipation performance and preventing deformation due to thermal stress at the junction.

Method used

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  • Semiconductor device and its manufacturing method
  • Semiconductor device and its manufacturing method
  • Semiconductor device and its manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0060] In order to confirm the effect of the present invention, the inventors conducted a thermal cycle test comparing with the conventional structure on the amount of warpage of the base for heat dissipation, the rising temperature of the semiconductor chip, and the fatigue life of the solder layer, as shown in Tables 2 to 4 below and Figure 2 to Figure 7 Each test result is shown.

[0061] First, Table 2 is a table showing how the amount of warping of the heat dissipation base after soldering changes depending on the heat dissipation base and the type of soldering. In this test, the example using the above-mentioned C / C material for the heat dissipation base and the comparative example using conventional copper, and the case where solder containing lead (Pb) is used for the joint between the heat dissipation base and the circuit board The amount of warpage of each heat dissipation base was measured for the case of lead-free soldering.

[0062] In this test, a base with a l...

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Abstract

A semiconductor device includes a circuit board formed of an insulator substrate and having conductor patterns on both surfaces thereof, a semiconductor chip bonded to the circuit board with one of the conductor patterns therebetween, and a radiator base bonded to the circuit board with a solder layer through the other of the conductor patterns therebetween for conducting heat generated in the semiconductor chip to an outside device. The radiator base is formed of a material having anisotropic thermal conductivity so that the radiator base has thermal conductivity in a direction perpendicular to a bonding plane between the radiator base and the circuit board higher than that along the bonding plane. The radiator base has thermal expansion coefficient along a bonding plane with the circuit board different from that along the bonding plate of the insulator substrate by a predetermined value.

Description

technical field [0001] The present invention relates to a semiconductor device in which a semiconductor chip is bonded to one surface of a circuit board, and a heat dissipation base for dissipating heat generated by the semiconductor chip is bonded to the other surface, and a method for manufacturing the same, and more particularly relates to soldering and bonding circuits A substrate and a semiconductor device for heat dissipation and a manufacturing method thereof. technical background [0002] As the performance of semiconductor devices incorporated in recent electronic equipment and the like has increased, the amount of heat released from the semiconductor devices has also increased. Therefore, in order to protect such a semiconductor device, a configuration in which generated heat is dissipated by an external heat dissipation mechanism such as a heat sink is adopted. Fig. 8 is a cross-sectional view showing a schematic configuration of such a conventional semiconductor...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/36H01L21/44H01L21/50H01L21/58H01L23/12H01L23/14H01L23/34H01L23/373H01L31/111H05K7/20
CPCH01L2224/32225H01L23/3735H01L23/373H01L2924/13055H01L2924/00E02D29/149
Inventor 望月英司西村芳孝
Owner FUJI ELECTRIC CO LTD