Thin film structure and manufacturing method thereof
A manufacturing method and structure technology, which are applied in the direction of magnetic head using thin film, manufacturing magnetic flux sensitive magnetic head, magnetic recording head, etc., can solve the problems of increasing deviation of conductor volume, difficult lower spacer current, complicated manufacturing process, etc. Achieves the effect of reducing variation in resistance, preventing wiring breakage, and improving corrosion resistance
Inactive Publication Date: 2005-02-02
TDK CORPARATION
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Problems solved by technology
However, if there is a step of cutting off the conductor (protrusion), not only the manufacturing process is complicated, but also the volume of the conductor (protrusion) is reduced, causing the problem of increased resistance.
In addition, the variation in the volume of the conductor (protrusion) increases, resulting in non-uniform resistance
[0020] In addition, in the thin film structure described in Patent Document 6, it is difficult to supply a current for plating to form the lower pad 3A and the upper pad 3B, and further improvement is required.
Method used
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Embodiment Construction
[0102] figure 1 It is a partial plan view showing the structure of the rear end surface 31 of a slider 30 equipped with a magnetic head using the thin film structure of the present invention for electrode extraction. In addition, the upper surface of the slider 30 shown in the figure is the surface facing the recording medium.
[0103] figure 1 The slider 30 shown is made of alumina-titanium carbide (Al 2 o 3 - made of a ceramic material such as TiC), and a thin-film magnetic head 32 is laminated on the rear end surface 31 on the side facing the recording medium.
[0104] The thin-film magnetic head 32 is a so-called composite thin-film magnetic head in which an MR head for reproduction and an inductive magnetic head for recording are laminated.
[0105] Such as figure 1 As shown, on the rear end surface 31 of the slider 30, four conductor layers 33-36 are formed by plating. The wire layers 33 and 34 are coil wire layers conductively connected with the coil layers con...
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Abstract
Provided is a thin-film structure having high mechanical strength, used for connection for continuity. An extended part 86b is formed in an upper layer part 86 to be bulged to the outside more than a side edge part 86a or the side edge part 81b of a base part 81, and a coil insulating layer (insulating layer) 57 is present below the extended part 86b. Because of the coil insulating layer (insulating layer) 57 below the extended part 86b of a raised part 87, mechanical strength around the raised part 87 is improved. Thus, cracking is not likely to occur in a protective layer (insulating layer) 61, thereby improving the corrosion resistance of the conductive connection structure.
Description
technical field [0001] The present invention relates to a thin film structure in which conductive protrusions are stacked on a conductive layer and surrounded by an insulating layer formed on the conductive layer, and particularly relates to a film with strong mechanical impact resistance, etc. Structures and methods of making them. Background technique [0002] Figure 40 It is a sectional view showing a conventional thin film structure. In this thin film structure, for example, a conductive layer 2 connected to a wire layer extending from a coil layer of an induction head or a wire layer extending from an electrode layer of a magnetoresistance effect element is formed on an insulator 1 . On the conductive layer 2 , a protrusion (convex portion) 4 is formed via a metal film 3 . Around the protruding portion (convex portion) 4, formed by Al 2 o 3 or SiO 2 The insulating film 5 is formed so that the upper surface of the protrusion (protrusion) 4 is exposed on the surface...
Claims
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IPC IPC(8): G11B5/31G11B5/33
CPCY10T29/49032Y10T29/4906Y10T29/49162Y10T29/49155Y10T29/49146Y10T29/49064G11B5/33
Inventor 矢泽久幸
Owner TDK CORPARATION