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Epoxy resin compositions

A technology for curing epoxy resins and compositions, which is applied in the preparation of organic compounds, organic chemistry, chemical instruments and methods, etc., and can solve the problems of low curing speed, practical application limitations, and unfavorable economic benefits of polyoxyalkylene polyamines

Inactive Publication Date: 2005-02-09
AIR PROD & CHEM INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, compositions with extended pot life can be prepared with epoxy resins, but the disadvantage is that the curing speed of the starting material polyoxyalkylene polyamine is substantially low, which limits the practical application
However, the ketone with a substituent at the α position used is a special chemical material, so it is unfavorable in terms of economic benefits

Method used

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  • Epoxy resin compositions
  • Epoxy resin compositions
  • Epoxy resin compositions

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach

[0060] The invention is more fully illustrated by the following examples, but the invention is not limited to these examples.

[0061] Preparation of ketimine

[0062] The ketimines used in Examples 1-3 (derived from amines having 2 or more primary amino groups directly bonded to the cyclohexane ring), and the ketimines used in Comparative Examples 1-4 are all Prepared by the following preparation example.

preparation example 1

[0064] Ketimines derived from 1,2-diaminocyclohexane (DACH) and 4-methyl-2-pentanone (MIBK).

[0065] Charge 57 g (0.5 mol) of 1,2-diaminocyclohexane and 250 g (2.5 mol) of 4-methanocyclohexane into a 500 g volumetric flask equipped with a magnetic stirrer, thermometer, nitrogen inlet, and Dean-Stark apparatus Base-2-pentanone. The temperature was slowly raised to 160° C. using a mantle heater, and 4-methyl-2-pentanone was refluxed at this time. The water distilled off during reflux is collected in a separator vessel. When the amount of collected water reached 18 g, the temperature was raised to 180° C. and maintained at this temperature for 2 hours, thereby removing the remaining 4-methyl-2-pentanone. After cooling, 135 g of the target ketimine residue was obtained in the flask. The viscosity of the product at 25° C. was 9.7 mPa.s, and the calculated active hydrogen equivalent was 67.

preparation example 2

[0067] Ketimines derived from bis(aminocyclohexyl)methane (PACM) and 4-methyl-2-pentanone.

[0068] Into the same flask as in Preparation Example 1, 105 g (0.5 mol) of bis(aminocyclohexyl)methane and 250 g (2.5 mol) of 4-methyl-2-pentanone were charged, and the same operation as above was performed. As a result, 183 g of ketimine was obtained from bis(aminocyclohexyl)methane and 4-methyl-2-pentanone. The viscosity of the product at 25° C. was 180 mPa.s, and the calculated active hydrogen equivalent was 92.

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Abstract

An epoxy resin composition is provided which has a longer working time, the so-called pot-life, and is used as adhesives, sealing agents or paints. The composition comprises a polyepoxide compound (Component A) and a ketimine (Component B) derived from the condensation reaction of an amine having 2 or more primary amino groups directed bonded to a cyclohexane ring and an aliphatic ketone.

Description

technical field [0001] The present invention relates to a curable epoxy resin composition. More particularly, the present invention relates to a curable epoxy resin composition having a longer shelf life, that is, after the polyepoxide and curing agent are mixed, by keeping the mixture in an uncured state for a specified period of time, Instead, the composition remains in a working condition suitable for application (or handling) for a longer period of time. Background technique [0002] The term "epoxy resin" is a general term for chemicals with active epoxidized groups in the molecule, which can react quickly or slowly depending on the environment, method used, or composition when mixed with various active hydrogen compounds, and into the solidification phase. The process of changing the structure of the epoxy resin composition into a polymer having a three-dimensional structure is called "curing". Epoxy resins have been widely used in semiconductor encapsulants, printe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/50C07C251/08C08G59/40
CPCC08G59/4042C07C2101/14C07C251/08C07C2601/14
Inventor 千叶康夫森本裕也横枕祐浩
Owner AIR PROD & CHEM INC