Wiring pattern check up apparatus

Abstract

Provided is an inspection apparatus of a wiring pattern that has a small number of false detections and can reduce inspection time by combining an inspection by vertical illumination and that by reflection illumination. A pattern 5a on a TAB tape 5 is carried to an inspection section 1 by a tape conveyance mechanism 10, illumination light is applied from a transmission illumination means 1a, the transmitted illumination image of the pattern 5a is imaged by a CCD line sensor 1c, illumination light is applied from a vertical illumination means 1b, and the vertical illumination image from the pattern 5a is imaged. The captured image is sent to a control section 4. The control section 4 compares the pattern of the transmission illumination image with a first reference pattern, inspects the pattern 5a, compares the pattern of the vertical illumination image at a position corresponding to a faulty section with a second reference pattern regarding the pattern 5a that is determined to be a faulty candidate, and determines whether the pattern 5a is conforming or not.

Description

technical field [0001] The present invention relates to a wiring pattern inspection device which irradiates a tape-loaded TAB (TapeAutomated Bonding) tape with illumination light, uses an imaging device to pick up the wiring pattern formed on the TAB tape, and compares it with a standard pattern to automatically perform an appearance inspection. . Background technique [0002] In order to meet the requirements of high integration and high-density assembly, semiconductor devices are advancing multi-lead and miniaturization. In order to facilitate the increase in number of leads and miniaturization, a method of connecting a semiconductor chip to a plurality of leads provided on a film-shaped TAB tape is employed. [0003] Figure 5 Indicates the order in which TAB tapes are made. [0004] Such as Figure 5 As shown in (a), the TAB tape 101 is on a resin film 102 with a thickness of about 20 to 150 μm (mostly 25 to 75 μm) and a width of about 35 to 165 μm. The adhesive 104 h...

AI Technical Summary

Problems solved by technology

[0033] As described above, it is difficult to inspect the thickness of the wiring pattern by only inspecting by reflected illumination light or inspection by transmitted illumination light, and it is impossible to detect false inspections caused by adhering dust.

[0034] As described in the above-mentioned Patent Document 1, if reflected light and transmitted light are used, and both reflected illumination images and transmitted illumination images are used for inspection, it is considered that the above-mentioned false detection can be prevented. However, how to determine the formation of It is unclear whether the wiring pattern on the above-mentioned light-transmitting substrate is qualified

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