Method for dividing disc-like workpiece

A technology for dividing discs and workpieces, applied in electrical components, manufacturing tools, metal processing, etc., can solve problems such as damaged circuits and low-k film peeling
CN1579728AInactive Publication Date: 2005-02-16DISCO CORP
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Patent Information

Authority / Receiving Office
CN ยท China
Patent Type
Applications(China)
Current Assignee / Owner
DISCO CORP
Publication Date
2005-02-16
Estimated Expiration
Not applicable ยท inactive patent

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Abstract

A method of dividing a plate-like workpiece having a layer that is made of a different material from that of a substrate and is formed on the front surface of the substrate along predetermined dividing lines, comprising a laser beam application step for applying a laser beam along the dividing lines formed on the plate-like workpiece to form a plurality of grooves deeper than the layer and a cutting step for cutting the plate-like workpiece with a cutting blade along the plurality of grooves formed in the laser beam application step, wherein a length between the outer sides of grooves on both sides formed in the laser beam application step is set to be larger than the thickness of the cutting blade and the cutting blade cuts the area between the outer sides of the grooves on both sides in the cutting step.
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Description

technical field

[0001] The present invention relates to a method of dividing a disk-shaped workpiece, such as a semiconductor wafer or the like. In particular, it relates to a method for dividing a disc-shaped workpiece having a layer made of a different material than the substrate and formed on the front side of the substrate along predetermined dividing lines. Background technique

[0002] As is well known to those skilled in the art, in the production process of semiconductor devices, by dividing the plurality of regions by dividing lines called "scribe lines", the dividing lines Individual semiconductor chips are produced by forming circuits such as ICs or LSIs in a lattice pattern on the front surface of a semiconductor wafer and dicing the semiconductor wafer along dicing lines to divide it into circuit-formed regions. Slicing along a dicing line of a semiconductor wafer is usually performed by a dicing machine called a "dicer". The dicing machine includes a chuck ta...

Claims

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