Direct application voltage variable material, components thereof and devices employing
A device and composite technology, applied in the field of piezo-change materials, can solve problems such as leaving no space, and achieve the effect of eliminating need and low cost
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0054] refer to figure 2 , the voltage variable material (“VVM”) 100 of the present invention includes an insulating adhesive 50 . Binder 50 secures one or more or all of certain different types of particles, such as insulating particles 60, semiconducting particles 70, doped semiconducting particles 80, conducting particles 90, and various combinations thereof. The insulating adhesive 50 has substantially adhesive properties and self-bonds to a surface such as a conductive metal surface or a non-conductive insulating surface. The insulating adhesive 50 has self-curing properties such that the VVM 100 can be applied to a circuit or application and can be used without heating to cure the VVM 100 and the insulating adhesive 50 . However, it should be appreciated that circuits or applications employing VVM 100 with adhesive 50 may be heated or cured to speed up the curing process.
[0055] In one embodiment, the insulating adhesive 50 of the VVM 100 includes a polymer or therm...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 