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Method and apparatus for conductive ball bonding of components

A technology of conductive balls and components, which is applied in the direction of assembling printed circuits, welding equipment, electrical components, etc. with electrical components, and can solve the problems of high voltage value and sparks that destroy the read/write circuit, easy to be cleared, too brittle, etc.

Inactive Publication Date: 2005-07-20
SAE MAGNETICS (HK) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If it is too small, then it may not be able to form an electrical connection during manipulation of the slider / suspension (such as during "head flapping"), or it is too brittle and easy to remove
If too large, the electrical connection may extend to other pads on the slider / cantilever, making it inoperable
Such systems also include high voltage values ​​and sparks that can destroy the read / write circuits of sliding bodies (especially MR sensors)

Method used

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  • Method and apparatus for conductive ball bonding of components
  • Method and apparatus for conductive ball bonding of components
  • Method and apparatus for conductive ball bonding of components

Examples

Experimental program
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Embodiment Construction

[0015] refer to image 3 , which shows a diagram of a first operational step according to an embodiment of the present invention. In this embodiment, firstly a plurality of conductive balls are provided. like image 3 As shown, the conductive balls 11 are arranged in the tray 12 . In this example, the conductive balls are made of gold. Depending on the size of the solder joint, the conductive balls can come in different sizes. If the pad size is 140 microns, the conductive balls may have a diameter of 130 microns and a tolerance of 20 microns. If the pad size is 90 microns, the conductive balls may have a diameter of 85 microns and a tolerance of 15 microns. In this example, the conductive balls are made by an atomization process that produces balls of a wide range of diameters. Based on the filtering process, balls meeting the above conditions are classified. The conductive balls described herein are also commercially available from Technic, Inc. (Cranstown, Rhode Isla...

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PUM

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Abstract

According to an embodiment of the present invention, an improved method and system are provided. In one embodiment, gold balls are provided and a holder using a vacuum suction force is used to pick up each gold ball. The ball is then placed next to the desired bonding pad(s) and vibrated to achieve partial melting of the ball and bonding pad(s).

Description

technical field [0001] The present invention relates to methods and apparatus for manufacturing components of hard disk drives. More particularly, the present invention relates to methods and apparatus for conductive ball bonding of solder joints on components such as slider assemblies and cantilevers. Background technique [0002] A hard disk device as a common information storage device basically consists of a series of rotatable disks accessed by magnetic read-write elements. These data transfer elements, known as sensors, are typically carried by and contained in sliders held in close proximity relative to above discrete data tracks formed on the disc to allow read and write operations to be performed. To locate the exact position of the sensor based on the disk surface, flowing air passes over an air bearing surface (ABS) formed on the slider, creating sufficient buoyancy to "fly" the slider and sensor over the disk data tracks. A disk rotating at high speed generates...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/00B23K1/06B23K3/06G11B5/60G11B21/21H01L21/60H05K3/34
CPCH05K3/3478H05K2203/0195B23K1/0016H05K2203/0292H05K2203/082B23K2201/36H05K2203/041B23K1/06B23K3/0623B23K2101/36H01L2224/16
Inventor M·赫尔南德兹E·查H·田
Owner SAE MAGNETICS (HK) LTD