Structure package
A semiconductor and chip technology, applied in the field of integrated structure packaging, can solve problems such as complexity and increased complexity
Inactive Publication Date: 2005-08-03
埃德万帕克索鲁申斯有限公司
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- Abstract
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- Claims
- Application Information
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Problems solved by technology
However, as the number of antenna layers increases, the interconnection between the antenna layers adds complexity
And requires a complex process to form the antenna layer and the insulating layer used to support and isolate the antenna layer
Method used
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[0030] In a first embodiment of the present invention, a structural package 20 will refer to figure 1 is depicted, showing a partial front view of the structural package.
[0031] like figure 1 As shown, structural package 20 includes a semiconductor chip 22 containing an integrated circuit (not shown) and a substrate 26 having a first circuit layer 28 and a second circuit layer 30 formed thereon. Substrate 26 is preferably a printed circuit board (PCB). The substrate 26 has a first face 32a and a second, outwardly facing face 32b opposite the first face 32a. The first circuit layer 28 is formed on the first surface 32 a, and the second circuit layer 30 is formed on the second surface of the substrate 26 .
[0032] A plurality of posts 34 extend from semiconductor chip 22 to substrate 26 such that semiconductor chip 22 and substrate 26 are structurally coupled to each other and spatially displaced from each other. A first portion of the plurality of pillars 34 is used to e...
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Wireless devices use protruding antennas for transmitting and receiving data signals. These protruding antennas govern the size and dimensions of these wireless devices. Perpetual reduction in the size of these wireless devices has resulted in an increasing need and desire to eliminate the protruding antennas. Solutions such as reducing the protruding antenna to a stub or using retractable antennas have limitations. The antenna stub sacrifices performance for size reduction. Additionally, the retractable antennas are usually physically separated from the integrated circuit. Electrical connectors interconnecting the external antenna and the integrated circuit can mechanically fail due to connector flexure. An improved integrated structure package is described according to embodiments of the invention where a plurality of pillar structures is used for inter-coupling and spatially displacing one or more semiconductor chips from a substrate to realise a stacked antenna configuration for space and footprint reduction. The good structural integrity of the plurality of pillars also provides mechanically robust electrical interconnections between circuits and antenna patterns formed on the substrate or in the semiconductor chip. The plurality of pillars can be further arranged for providing faraday shielding to an integrated circuit from electromagnetic interference. Dielectric material is further introduced between pairs of the plurality of pillars for forming capacitors for reducing parasitic capacitance.
Description
technical field [0001] The present invention generally relates to structural packaging. More particularly, the present invention relates to an integrated structural package for use as an integrated data transceiver for transmitting and receiving data signals. Background technique [0002] Radios use protruding antennas to send and receive data signals. These protruding antennae determine the size and dimensions of these radios. Long-term efforts to reduce the size of these radios have created an increasing need and desire to eliminate protruding antennas. A straightforward solution is to shrink the protruding antenna down to a stub. Another straightforward solution is to use a retractable antenna in the radio. However, these straightforward solutions have limitations. [0003] Antenna stubs sacrifice performance for size, while retractable antennas have to be fully extended during use for optimal performance. Also, the retractable antenna is usually physically separate...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H01L23/02H01L23/498H01Q1/24H01Q1/38
CPCH01L2924/0002H01L23/49855G06K19/0775H01L2924/00
Inventor 黄银燕
Owner 埃德万帕克索鲁申斯有限公司