Exposure method, exposure apparatus, and method for manufacturing device

Abstract

A substrate (W) serves as a part of a partition wall and an injection end side of a shot optical system (PL) is filled with a penetrating gas penetrating an energy beam (IL). When the substrate (W) is moved or exchanged, in order to maintain the gas state at the injection end side of the shot optical system (PL), an object (70) is arranged at the injection end side of the shot optical system (PL) instead of the substrate (W). Thus, it is possible to properly exclude light absorbing substance from the injection end side of the shot optical system and maintain the gas state even when the substrate is moved or exchanged.

Description

technical field [0001] The present invention relates to an exposure method and an exposure apparatus for manufacturing electronic devices such as semiconductor elements, liquid crystal display elements, imaging elements (CCD, etc.), and thin-film magnetic heads, and a method for manufacturing the devices. Background technique [0002] When electronic devices such as semiconductor elements and liquid crystal display elements are manufactured by photolithography, the image of the patterned mask or reticle (reticle - hereinafter referred to as reticle) is projected onto the photosensitive coating through the projection optical system. A projection exposure device for each projected (photographed) area on the substrate of the material (resist). The circuit of the electronic device is formed by exposing and transferring the circuit pattern on the exposed substrate by the above-mentioned projection exposure apparatus, and post-processing. [0003] In recent years, high-density in...

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Problems solved by technology

However, if the permeable gas flows into the optical path of the interferometer, the optical path length of the laser light will change due to the difference in the refractive index between the gas (air) and the permeable gas that existed on the interferometer optical path before then. Potentially reduce the control accuracy of the interferometer system

[0009] When the substrate is placed on the exit end side of the projection optical system, the substrate will become a part of the partition, so the leakage of the above-mentioned gas can be suppressed, but when moving the substrate or exchanging the substrate, at least part of the substrate that becomes the partition Part of it will leave the exit end side of the projection optical system, so that the state of the gas on the exit end side of the projection optical system will be destroyed, and the above-mentioned gas leakage will easily occur.

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