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Apparatus for controlling the pressure in a process chamber and method of operating same

A technology for controlling processing and processing chambers, applied to the components of pumping devices for elastic fluids, pump control, mechanical equipment, etc., can solve problems such as pump damage, pump exceeding heat limit, etc.

Inactive Publication Date: 2005-08-31
EDWARDS LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The first pump unit usually has a turbomolecular pump, and the use of a throttle valve downstream is considered undesirable because the backpressure of the pump increases to such an extent that adjustment of the valve affects pressure variations in the process chamber, which Causes the pump to exceed its thermal limit, which can destroy the pump
It has also been found that the throttling valve can only effectively control the process chamber pressure when the valve is adjusted within a small range between the two states of fully open and fully closed, which means that the valve must be operated precisely

Method used

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  • Apparatus for controlling the pressure in a process chamber and method of operating same
  • Apparatus for controlling the pressure in a process chamber and method of operating same
  • Apparatus for controlling the pressure in a process chamber and method of operating same

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Embodiment Construction

[0027] Such as figure 1 As shown in , the inlet of the semiconductor processing chamber 10 is fluidly connected to an upstream valve 12 to control the introduction of process gas into the processing chamber. Many different process gases are used in the processing of semiconductor products. For example nitrogen, argon or chlorine. It will be appreciated that the molecular or atomic structures of these gases vary considerably, and thus have different requirements for the pumping means downstream of the process chamber 10, and that the process chamber also requires different pressures.

[0028] The pumping device described is not only applicable to semiconductor processing chambers, but also applicable to pressure control in other types of processing chambers.

[0029] The outlet of the processing chamber 10 is fluidly connected to the inlet of the first pump unit 14, which as shown includes a turbomolecular pump (TMP), which may include a turbomolecular pump stage, a molecular...

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Abstract

A method of operating apparatus for controlling the pressure in a process chamber (10), the apparatus comprising a first pump unit (14) having an inlet in fluid connection with an outlet of said process chamber, and a second pump unit (16) having an inlet in fluid connection with an outlet of the first pump unit via a flow control unit (18) comprising a variable flow control device (20; 28) having variable conductance for controlling outlet fluid pressure at the outlet of the first pump unit, the method comprises controlling speed of the first pump unit to increase the range of chamber pressures over which control of the outlet fluid pressure produces changes in said chamber pressure without exceeding the thermal limit and / or motor stall limit of the first pump unit.

Description

technical field [0001] The invention relates to a device for controlling the pressure in a processing chamber and an operation method thereof. Background technique [0002] The pressure within a semiconductor processing chamber is generally achieved by varying the flow of process gas exhausted from the processing chamber by a vacuum pump. These vacuum pumps consist of a first pump unit with a turbomolecular pump and a second pump unit with a backing pump. [0003] Typically the inlet of the first pump unit is connected in fluid communication with the outlet of the semiconductor processing chamber, and the inlet of the second pump unit is also connected in fluid communication with the outlet and exhaust port of the first pump unit. [0004] Different process gases are used in different semiconductor processing methods, and the flow rate of each gas through the processing chamber has a predetermined relationship with the pressure in the processing chamber. Therefore, the pre...

Claims

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Application Information

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IPC IPC(8): F04C18/02F04C23/00F04D19/04F04D25/00F04D25/16G05D16/20H01L21/3065
CPCF04C2220/12G05D16/2073F04D25/00F04C18/0207F04D19/04F04C25/02F04C23/005F04C2220/30F04D27/0253Y10T137/86083Y10T137/0379Y10T137/86139Y10T137/0396
Inventor M·E·托尔纳
Owner EDWARDS LTD
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