Apparatus for controlling the pressure in a process chamber and method of operating same

A technology for controlling processing and processing chambers, applied to the components of pumping devices for elastic fluids, pump control, mechanical equipment, etc., can solve problems such as pump damage, pump exceeding heat limit, etc.
CN1662746AInactive Publication Date: 2005-08-31EDWARDS LTD
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
EDWARDS LTD
Publication Date
2005-08-31
Estimated Expiration
Not applicable · inactive patent

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Abstract

A method of operating apparatus for controlling the pressure in a process chamber (10), the apparatus comprising a first pump unit (14) having an inlet in fluid connection with an outlet of said process chamber, and a second pump unit (16) having an inlet in fluid connection with an outlet of the first pump unit via a flow control unit (18) comprising a variable flow control device (20; 28) having variable conductance for controlling outlet fluid pressure at the outlet of the first pump unit, the method comprises controlling speed of the first pump unit to increase the range of chamber pressures over which control of the outlet fluid pressure produces changes in said chamber pressure without exceeding the thermal limit and / or motor stall limit of the first pump unit.
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Description

technical field

[0001] The invention relates to a device for controlling the pressure in a processing chamber and an operation method thereof. Background technique

[0002] The pressure within a semiconductor processing chamber is generally achieved by varying the flow of process gas exhausted from the processing chamber by a vacuum pump. These vacuum pumps consist of a first pump unit with a turbomolecular pump and a second pump unit with a backing pump.

[0003] Typically the inlet of the first pump unit is connected in fluid communication with the outlet of the semiconductor processing chamber, and the inlet of the second pump unit is also connected in fluid communication with the outlet and exhaust port of the first pump unit.

[0004] Different process gases are used in different semiconductor processing methods, and the flow rate of each gas through the processing chamber has a predetermined relationship with the pressure in the processing chamber. Therefore, the pre...

Claims

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