Method of scribing on brittle matetrial, scribe head, and scribing apparatus with the scribe head

Abstract

A scribing method that provides in a glass plate particularly deep vertical cracks that form scribe lines crossing each other. With the method, the glass plate can be cut apart exactly along the scribe lines in a cut-apart step after the cross scribing. On a scribe head main body (2) that travels on a brittle material, there is provided a tip holder (4) so as to be swingable about the axis of a support shaft (9) that is parallel to a face of the brittle material. A scribe head (1) has the tip holder (4) and a cutter wheel tip (5) that is installed on the holder so as to be rotatable about the axis of a rotation shaft (13) that is parallel to the brittle material face. With the support shaft (9) facing the backside with respect to the cutter wheel tip (5), the scribe head (1) is made to travel on the brittle material face to form a scribe line on the face.

Description

technical field [0001] The invention relates to a method for forming a scribe line on the surface of brittle materials such as plate glass, semiconductor wafer, ceramics, etc., a scribe head and a scribe device with the scribe head. Background technique [0002] Conventionally, square glass used as an electronic component material is obtained by cutting a single large glass as a base material. When such cutting is performed, first, the cut-off grinding wheel bit is press-contacted to the surface of the base material in one direction and rolled while passing through the traveling start position. Secondly, change the rotation direction of the cutting wheel head to the direction crossing the last rolling direction to form the same scratch line. Thereby, scribe lines intersecting each other are formed (hereinafter, this scribe method is referred to as cross scribe processing). Next, the cross-marked base material is conveyed to a cutting machine, where a given pressure is appl...

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Problems solved by technology

[0021] However, the range of load on the cutting edge in area B is extremely narrow. As mentioned above, the floating phenomenon of the bit holder in the prior art cannot be avoided. Therefore, the pressing force toward the cutting wheel bit will be weakened by the above-mentioned reaction force R , it is very difficult to adjust the blade load in the extremely narrow B region mentioned above

[0022] In addition, in the reticle, in order to prevent the occurrence of the above-mentioned transition of the intersection point, for the formation of the second scribe line, compared with the formation of the first scribe line, the load on the blade must be greatly increased. cause, tends to cause the cutting edge load to enter the above C area, and as a result, the problem of generating a large amount of chips inevitably occurs

[0023] Further, another problem different from the above-mentioned problem is that, in the scribing using the above-mentioned conventional cutting wheel, the bending or deflection of the glass, the unevenness of the glass surface, the bit holder for holding the cutting wheel bit or the Due to external reasons such as shaking of the scribing head holding the cutter head holder, the disadvantage of not being able to obtain a stable scribing line occurs frequently.

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